Solar cell diffusion deep junction preparation method
A solar cell, deep junction technology, applied in circuits, photovoltaic power generation, electrical components, etc., can solve problems such as the concentration difference in the PN junction area, increase the phosphorus concentration difference in the junction area, improve Uoc and FF, and improve battery conversion efficiency. Effect
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[0019] Use the cleaning texture process to remove the damaged layer of the silicon wafer and prepare the anti-reflection texture.
[0020] A layer of SiO2 was prepared on the surface of the silicon wafer using a diffusion furnace with an oxygen flow rate of 600 sccm, a nitrogen flow rate of 700 sccm, a time of 300 s, a pressure of 100 mbar, and a reaction temperature of 780 °C.
[0021] Deposit a constant impurity phosphorus source on the surface of the silicon wafer, the first deposition: small nitrogen flow rate 800sccm, nitrogen flow rate 600sccm, oxygen flow rate 500sccm, time 200s, pressure 100mbar, reaction temperature 790°C; second deposition temperature 800°C, other conditions Same as the 1st deposition. Remarks: Small nitrogen is the carrying gas of PClO3.
[0022] The phosphorus atoms produced by the reaction are pushed into the silicon wafer to form a PN junction. The temperature is 865°C, the nitrogen flow rate is 1500 sccm, the pressure is 100 mbar, and the time...
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