Detection device based on energy conservation of chip on financial electronic circuit board

Abstract

The invention relates to the technical field of electronic detection, in particular to a detection device based on energy conservation of a chip on a financial electronic circuit board. The outer wallof a detection frame is movably connected with a first guide plate in a penetrating mode, a detection plate is fixedly connected to one end of the first guide plate and located on the inner side of the detection frame, the other end of the first guide plate is fixedly and movably connected with a threaded rod, the upper side and the lower side of the threaded rod are meshed with gears, the upperends and the lower ends of the gears are meshed with connecting rods, and one ends of the connecting rods are movably connected with touch plates. When pins of the chip are not well installed and welded and a wafer is exposed, a circuit connected with the detection plate forms a closed loop, then a baffle is driven to be close to and clamped between racks of the gears, the gears stop rotating, atthe moment, the chip can be clamped in the detection plate all the time and cannot be moved away along with an assembly line, a worker can conveniently take out the chip for processing, the accurate detection effect is achieved, and the situations of missing detection and wrong detection are prevented.

Description

technical field [0001] The invention relates to the technical field of electronic detection, in particular to a detection device based on chip energy saving on a financial electronic circuit board. Background technique [0002] E-finance is a financial activity that exists in the electronic space. Its existence form is virtualized and its operation mode is networked. In the chip manufacturing process, there is a process of wafer packaging, which is to weld the wafer to the metal After the welding is completed, a layer of glue is added to the surface of the wafer to protect the wafer. The chip is installed on the corresponding groove of the card body. When the position and height of the chip are consistent with the position and depth of the groove When there is a mismatch, a part of the wafer will be exposed, which will invalidate the chip. Therefore, the chip cannot be directly loaded into the product. If there is a problem with the overall debugging of the product, it needs...

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Problems solved by technology

[0002] E-finance is a financial activity that exists in the electronic space. Its existence is virtualized and its operation mode is networked. In the chip manufacturing process, there is a process of wafer packaging, which is to weld the wafer to the metal After the welding is completed, a layer of glue is added to the surface of the wafer to protect the wafer. The chip is installed on the corresponding groove of the card body. When the position and height of the chip are consistent with the position and depth of the groove When there is a mismatch, a part of the wafer will be exposed, which will make the chip invalid. Therefore, the chip cannot be directly loaded into the product. If there is a problem with the overall debugging of the product, it needs to be disassembled and repaired, resulting in a waste of manpower. Generally speaking, the processing factory will conduct all or sampling inspections on the chips on the circuit boards of electronic products before assembling the products.

[0003] However, since the pins of the chip are generally small, it is difficult to detect such problems manually. If it is directly installed in the product, it needs to be disassembled and replaced if there is a problem, which will affect the production efficiency. The detection of the chip is generally done manually. It is relatively boring and cumbersome, and it is a simple repetitive labor. In actual operation, problems such as missed detection and wrong detection are prone to occur. Therefore, those skilled in the art provide a detection device based on energy-saving chips on financial electronic circuit boards to solve the above background. questions raised in technology

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