Chip inductor gluing machine

A gluing machine and inductance technology, which is applied in the manufacture of inductance/transformer/magnet, circuits, electrical components, etc. It can solve the problems of reducing the amount of glue on the inductor line, the height difference of the circuit board, and the effect of reducing the glue, so as to improve the effect, the effect of increasing the amount of glue

Inactive Publication Date: 2020-12-11
姜老板
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies in the prior art, the object of the present invention is to provide a sheet-shaped inductance gluing machine to solve the problem in the prior art that the inductance is wound with an inductance wire, so that a gap is formed between its two ends, and the When the circuit board is connected, there will be a gap and there will be a certain height difference between the circuit board and the circuit board. Then, when the glue is applied, the inductive glue will pile up between the terminals and slide to both sides, forming a conical glue. The problem of reducing the amount of glue with the inductor wire and reducing the effect of the glue

Method used

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  • Chip inductor gluing machine
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Examples

Experimental program
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Effect test

Embodiment 1

[0028] Example 1: Please refer to Figure 1-Figure 6 , the specific embodiments of the present invention are as follows:

[0029] Its structure includes a chassis 1, a conveying line 2, a feeding hopper 3, a side plate 4, an adhesive structure 5, and a hopper 6. The conveying line 2 is installed horizontally on the upper end and is mechanically connected, and the feeding hopper 3 is vertically Installed on the upper end of the conveying line 2 and fixed by bolts, the side plate 4 is fixed on the side end of the conveying line 2 and welded with the chassis 1, the adhesive structure 5 is installed horizontally on the upper end of the conveying line 2 and straddles the conveying line 2 At the upper end, the discharge hopper 6 is installed at the lower left end of the conveying line 2 and is mechanically connected; the adhesive structure 5 includes a mounting plate 51, a bracket 52, an adjustment rod 53, a glue injection structure 54, and a pump body 55. The mounting plate 51 is ...

Embodiment 2

[0036] Example 2: Please refer to image 3 , Figure 7-Figure 8 , the specific embodiments of the present invention are as follows:

[0037] The glue injection structure 54 includes an outer frame 541, an inner groove 542, a slide rail 543, an adjustment structure 544, and a protective structure 545. The inner groove 542 is arranged inside the outer frame 541 and is an integrated structure, and the slide rail 543 is embedded The adjustment structure 544 is vertically installed on the lower end of the slide rail 543 and adopts a flexible connection. The protective structure 545 is horizontally installed on the lower end of the outer frame 541 and is arranged outside the adjustment structure 544 .

[0038] Referring to 7, the protective structure 545 includes a connecting frame 45a, an inner rail 45b, a limiting plate 45c, and a side movable plate 45d. Installed on the inner side of the inner rail 45b and adopts a flexible connection, the side movable plate 45d is hinged to th...

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PUM

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Abstract

The invention discloses a chip inductor gluing machine, which structurally comprises a case, a conveying line, a feeding hopper, a side plate, a gluing structure and a discharging hopper, the conveying line is horizontally installed at the upper end, the feeding hopper is vertically installed at the upper end of the conveying line, the side plate is fixed to the side end of the conveying line, thegluing structure is horizontally installed at the upper end of the conveying line, and the discharging hopper is installed at the lower left end of the conveying line. The gluing structure comprisesa mounting plate, a support, an adjusting rod, a glue injection structure and a pump body, the mounting plate is mounted at the side end of the support, the adjusting rod is vertically mounted at theupper end of the support, the glue injection structure is horizontally fixed to the front end of the support, and the pump body is arranged at the upper end of the mounting plate. An adhesive is conveniently piled up, so that the adhesive amount of the inductance wire is increased, and the adhesive effect is further improved; and a protection structure is arranged on the outer side of the adjusting structure, so that sliding viscose is blocked, and the viscose amount of the inductance wire on the inner side is guaranteed.

Description

technical field [0001] The invention belongs to the field of chip inductors, and in particular relates to a chip inductor gluing machine. Background technique [0002] The inductor mainly converts electrical energy into magnetic energy and stores it. It mainly tries to block the passage of current when it is energized, and tries to maintain the current when it is powered off. Its structure is mainly formed by winding an inductance coil. The shape inductor is a thin-film chip-type wire-wound inductor, which is relatively small. After it is installed on the circuit board, it needs to be glued, so that the inductor can be fixed while cooling and flame-retardant around it. However, the existing technology There are following deficiencies: [0003] Since the inductance is wound with an inductance wire, a gap is formed between its two ends, and there will be a gap when it is connected to the circuit board and there will be a certain height difference between the circuit board and...

Claims

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Application Information

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IPC IPC(8): H01F41/00
CPCH01F41/00H01F41/005
Inventor 姜老板
Owner 姜老板
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