Welding method of titanium target and copper back plate

A welding method and titanium target technology, applied in welding equipment, metal processing, metal processing equipment, etc., can solve problems such as low bonding rate and product deformation, and achieve the effect of prolonging service life and improving welding bonding rate

Inactive Publication Date: 2020-12-11
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the existing welding methods, there are still problems such as low bonding rate and product deformation after welding the target and the back plate.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] This embodiment provides a welding method for a titanium target and a copper back plate, the welding method comprising the following steps:

[0033] (1) Perform sandblasting and acid treatment on the welding surface of the titanium target and copper back plate in sequence; the roughness after sandblasting treatment is 80 μm, and the acid treatment is to use concentrated hydrochloric acid with a mass concentration of 33% at 35°C. 15min;

[0034] (2) Then braze the acid-treated titanium target and the copper back plate after adding indium solder to the welding surface to obtain a titanium target assembly; the welding temperature is 295 ° C, and the time is 17 minutes; Pressurized cooling, the pressure is 15MPa, and the time of pressurized cooling is 18min.

[0035] The obtained target assembly has a welding bonding rate of 95%, no deformation and long service life.

Embodiment 2

[0037] This embodiment provides a welding method for a titanium target and a copper back plate, the welding method comprising the following steps:

[0038] (1) Perform sandblasting and acid treatment on the welding surface of the titanium target and copper back plate in sequence; the roughness after sandblasting treatment is 100 μm, and the acid treatment is to use concentrated hydrochloric acid with a mass concentration of 36% at 30 ° C. 10min;

[0039] (2) Then braze the acid-treated titanium target and the copper back plate after adding indium solder to the welding surface to obtain a titanium target assembly; the welding temperature is 300 ° C, and the time is 20 minutes; Pressurized cooling, the pressure is 10MPa, and the time of pressurized cooling is 20min.

[0040] The welding combination rate of the obtained target assembly is 97%, no deformation, and long service life.

Embodiment 3

[0042] This embodiment provides a welding method for a titanium target and a copper back plate, the welding method comprising the following steps:

[0043] (1) Perform sandblasting and acid treatment on the welding surface of the titanium target and copper back plate in sequence; the roughness after sandblasting treatment is 60 μm, and the acid treatment is to use concentrated hydrochloric acid with a mass concentration of 30% at 40 ° C. 20min;

[0044] (2) Then braze the acid-treated titanium target and copper back plate after adding indium solder to the welding surface to obtain a titanium target assembly; the welding temperature is 290 ° C, and the time is 15 minutes; Pressurized cooling, the pressure is 20MPa, and the time for pressurized cooling is 15min.

[0045] The welding bonding rate of the obtained target component is 96%, no deformation, and long service life.

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Abstract

The invention relates to a welding method for a titanium target and a copper back plate. The welding method comprises the following steps that (1), sand blasting and acid treatment are sequentially conducted on the welding face of the titanium target and the welding face of the copper back plate; and (2), welding flux is added to the welding faces of the titanium target and the copper back plate after acid treatment, and then brazing is conducted to obtain a titanium target assembly. According to the welding method, due to the fact that special treatment, namely sand blasting and acid treatment are sequentially adopted on the welding faces, the coupling effect between the sand blasting and the acid treatment is utilized, the welding bonding rate is remarkably increased, the welded productdoes not deform, and meanwhile the back plate can also be repeatedly used.

Description

technical field [0001] The invention relates to the field of target welding, in particular to a welding method for a titanium target and a copper back plate. Background technique [0002] The coating target is a sputtering source that forms various functional thin films on the substrate by sputtering under appropriate process conditions through magnetron sputtering, multi-arc ion plating or other types of coating systems. [0003] In order to meet the needs of sputtering, the target usually needs to be welded together with the back plate. For example, CN107914075A discloses a target welding method, which includes: providing the target and the back plate; A flaky intermediate layer used as solder is placed between the plates; the intermediate layer is bombarded with electron beams to melt it quickly and fill it between the target and the back plate to achieve welding; the material of the intermediate layer is 4 series aluminum alloy. The target welding method reduces the pos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/20B23K3/00
CPCB23K1/20B23K3/00
Inventor 姚力军边逸军潘杰王学泽侯娟华
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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