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Display device

A technology for a display device and a display area, which is applied to semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve problems such as poor contact and chip-on-chip film 6 peeling, and achieve simplified structure, material saving, and simple structure Effect

Inactive Publication Date: 2020-11-24
山东傲晟智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this way, the chip-on film 6 is directly bonded to the driving electrode 5, which easily causes the chip-on film 6 to peel off from the driving electrode 5, resulting in poor contact.

Method used

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Examples

Experimental program
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Effect test

no. 1 example

[0036] refer to image 3 and Figure 4 , the display device of this embodiment is different from the display device of the prior art in that it additionally has a pressing wall 18 . The setting of the pressure wall 18 is to ensure that the COF 16 will not be disconnected from the driving electrodes 15, so as to ensure reliable transmission of driving signals.

[0037] The display device includes a substrate 11, which may be formed of any suitable insulating material having flexibility. For example, it can be made of polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) , polyarylate (PAR) or glass fiber reinforced plastic (FRP) and other polymer materials. The substrate 11 may also be rigid, such as glass.

[0038] The substrate 11 includes a display area and a non-display area, wherein the display area includes a display device 12, which may be an OLED display device, a mini-LED display device, and the...

no. 2 example

[0046] In this embodiment, no pressing wall is provided, and the improvement mainly lies in pressing the chip-on-chip film 16 by using the side walls of the cofferdam. see Figure 5 and Figure 6 , the bank dam 13 not only surrounds the display area, but also additionally surrounds the non-display area, which has a side wall in the non-display area, a part of which is bonded to the substrate 11 through a plurality of openings 17 in the chip-on-chip film 16 , so as to ensure the bonding force of the joint and reduce the risk of peeling.

[0047]In this embodiment, the side wall includes a first portion with a wider cross-section and a second portion with a narrower cross-section. The narrower second portion is located in the plurality of openings 17 , and the first portion is located on the COF 16 . Moreover, the plurality of openings 17 are arranged on the extension lines of the plurality of driving electrodes 15 in one-to-one correspondence, so as to further strengthen the...

no. 3 example

[0050] In the first embodiment, the pressing wall 18 is only bonded to the substrate 11 at the openings 17 , the bonding force is relatively small, and there is no protection for the driving electrodes 15 . In this embodiment, the shape of the pressing wall 19 is an inverted T shape, and its wider first part is attached to the substrate 11, and its narrower second part passes through the plurality of openings 17, wherein Both the first part and the second part are integrally formed by injection molding.

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Abstract

The invention provides a display device, which utilizes a pressing wall arranged in a non-display area to penetrate through a plurality of openings of a chip on film to ensure the bonding force between the chip on film and a substrate as well as between the chip on film and a driving electrode. The display device has a simple structure, and does not influence the formation of an encapsulation layer in a display area. Furthermore, in other embodiments, the wall pressing structure can be replaced by the side walls of a cofferdam, the structure can be simplified, and materials can be saved.

Description

technical field [0001] The invention relates to the technical field of light-emitting display, in particular to a display device. Background technique [0002] Currently, a display device often includes a display area and a non-display area, and the display area often requires an external drive module, and the drive module is connected to the non-display area through a chip-on-chip film to drive a display device in the display area. For details, please refer to figure 1 and figure 2 , the display device includes a substrate 1 and a display area and a non-display area on the substrate, the display area includes a display device 2 and a bank 3 surrounding the display device 2, and the bank 3 has a cover covering the The sealing layer 4 of the display device 2, the drive electrode 5 extends from the display area to the non-display area, and passes through the bottom of the bank 3, and the chip-on-chip film 6 is bonded to the drive electrode 5 in the non-display area one end...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L27/15H01L23/492H01L33/54H01L33/62H01L51/52
CPCH01L23/492H01L33/54H01L33/62H01L27/156H10K59/10H10K50/8428H10K50/844
Inventor 孙德瑞
Owner 山东傲晟智能科技有限公司
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