Melting device convenient for semiconductor graphite wafer processing and use method thereof

Abstract

The invention discloses a melting device convenient for semiconductor graphite wafer processing. The melting device comprises a base, wherein a melting box is fixedly arranged on the top surface of the base, and an equipment box is arranged at the top of one side of the melting box; and a partition plate is fixedly arranged on the upper portion in the melting box, and the melting box is divided into a smashing cavity and a melting cavity through the partition plate. Two crushing shafts are transversely arranged in the crushing cavity in parallel; a shaft body of each crushing shaft is sleevedwith a plurality of first sleeves, and a crushing assembly is fixedly arranged on the peripheral side of the surface of each first sleeve; a stirring shaft is transversely arranged in the melting cavity, a shaft body of the stirring shaft is fixedly sleeved with second casing pipes at equal intervals, and a disturbance assembly and a stirring assembly are fixedly arranged on the upper portion andthe lower portion of a pipe body of each second casing pipe respectively; the device is easy to operate, and the problems that the crushing efficiency is poor and the crushing quality and uniformity are poor are solved through the driving assembly and the crushing assembly; and through the turbulent flow assembly and the stirring assembly, the problems of longer time consumption and poorer mixingeffect during dissolution are solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor graphite wafer processing, in particular to a melting device and an application method for facilitating semiconductor graphite wafer processing. Background technique [0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; a wafer is a carrier used in the production of integrated circuits. Generally speaking, a wafer refers to a single crystal silicon wafer; Crystal silicon wafers are drawn and refined from ordinary silica sand, and are made into single crystal silicon rods through a series of measures of dissolution, purification and distillation. After the single crystal silicon rods are polished and sliced, they become wafers; The surface of the graphite wafer is coated with a graphene oxide ethanol solution containing boron or nitrogen to make a semiconductor graphite wafer; when re...

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Problems solved by technology

[0002] Wafer refers to the silicon chip used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer; a wafer is a carrier used in the production of integrated circuits. Generally speaking, a wafer refers to a single crystal silicon wafer; Crystal silicon wafers are drawn and refined from ordinary silica sand, and are made into single crystal silicon rods through a series of measures of dissolution, purification and distillation. After the single crystal silicon rods are polished and sliced, they become wafers; The surface of the graphite wafer is coated with a graphene oxide ethanol solution containing boron or nitrogen to make a semiconductor graphite wafer; when recycling the graphite wafer, it needs to be pulverized and melted. The existing graphite wafer pulverization device There are disadvantages of poor crushing efficiency, poor crushing quality and uniformity, and the disadvantages of long time-consuming and poor mixing effect of black wafer particles in dissolution due to insufficient crushing

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