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Liquid-cooled radiator, novel server radiating system and regulation and control method

A radiator and server technology, applied in instruments, pump control, hardware monitoring, etc., can solve problems such as energy waste, server cooling lag, etc., to avoid violent fluctuations, reduce the risk of downtime, and improve reliability.

Active Publication Date: 2020-11-20
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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Problems solved by technology

[0006] To solve the problem of hysteresis in the heat dissipation of the current server based on temperature value feedback, and the energy waste in the current heat dissipation method of air cooling and liquid cooling, the present invention provides a liquid-cooled radiator, a new server heat dissipation system and a control method

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  • Liquid-cooled radiator, novel server radiating system and regulation and control method

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Embodiment Construction

[0039] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0040] Such as figure 2 As shown, the embodiment of the present invention provides a liquid-cooled radiator for dissipating heat generated by a heat generating element during operation, including a heat dissipation base 1 and a plurality of heat dissipation fin groups arranged on the heat dissipation base 1 2;

[0041] Each heat diss...

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Abstract

The invention provides a liquid-cooled heat radiator, a novel server heat dissipation system and a regulation and control method. The liquid-cooled heat radiator comprises a heat dissipation base anda plurality of heat dissipation fin groups arranged on the heat dissipation base, wherein each heat dissipation fin group comprises a hollow pipe and two heat dissipation fins, the heat dissipation fins are of hollow structures, ends, away from the heat dissipation base, of the first heat dissipation fins and the second heat dissipation fins are connected through the hollow pipes, the first heat dissipation fins, the second heat dissipation fins and the hollow pipe form a communicated cavity, two ends of each of a plurality of radiating fin groups are respectively communicated with a water inlet and a water outlet after a plurality of radiating fin groups are communicated in series or in parallel or in series-parallel combination, the heat dissipation base is fixed to a heat generation element through fixing holes. When a liquid-cooled radiator works, a communicated cavity formed by the first radiating fins, the second radiating fins and the hollow pipe is filled with cooling liquid, heat dissipation efficiency of an air cooling system is improved, and the effect of saving energy can be achieved.

Description

technical field [0001] The invention relates to the technical field of server cooling system design, in particular to a liquid-cooled radiator, a novel server cooling system and a control method. Background technique [0002] Air-cooled heat dissipation and liquid-cooled heat dissipation are the two most commonly used heat dissipation methods for servers. Air-cooled heat dissipation is to drive the air flow through the fan, and take the heat generated by the heat-generating components out of the server to realize the heat dissipation of the system. When the fan is working, the faster the rotation speed, the higher the air flow rate and the stronger the cooling capacity. Liquid cooling is to place a radiator filled with coolant on the heat-generating components in the server, and then take the heat out of the server through the flow of the coolant to achieve heat dissipation. The faster the coolant flow rate, the more heat is taken away per unit time, and the stronger the c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F11/30G06F11/32F04D27/00
CPCG06F1/20G06F11/3058G06F11/327F04D27/004F04D27/008G06F2200/201Y02D10/00
Inventor 何业缘
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD
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