A kind of heat-conducting two-component potting glue and preparation method thereof

A potting, two-component technology, used in adhesives, polymer adhesive additives, non-polymer adhesive additives, etc., can solve the problems of insufficient weather resistance and poor compatibility of potting adhesives. To achieve the effect of convenient observation, low viscosity and good leveling

Active Publication Date: 2021-03-26
中电保力(北京)科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In order to solve the defects in the prior art that the addition of inorganic heat-conducting fillers leads to poor compatibility and insufficient weather resistance of the potting compound, the present invention uses a macromolecular coupling agent to modify the inorganic heat-conducting material, which strengthens the inorganic filler and The compatibility of silicone, while reducing the amount of inorganic fillers, maintains the light transmittance of silicone, which can facilitate the observation of the use and working conditions of electronic components; at the same time, it has excellent mechanical properties and weather resistance, and can be safe and stable for a long time The use provides great convenience in the industry

Method used

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  • A kind of heat-conducting two-component potting glue and preparation method thereof
  • A kind of heat-conducting two-component potting glue and preparation method thereof

Examples

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Effect test

preparation example 1

[0037] Methacrylic acid, allyl polyoxyethylene ether and vinyl trimethoxysilane are fed in a molar ratio of 8:3:1, and toluene 2.3 times the total mass of the monomer is added as a solvent, and heated to 80°C under a nitrogen atmosphere to reflux. Add 0.5wt% BPO of the total mass of the monomers dropwise, complete the dropwise addition in half an hour, continue to reflux for 4h, cool, filter, and vacuum dry to obtain a macromolecular coupling agent, which is prepared by adding toluene to a 30wt% solution.

[0038] Take 10 parts of aluminum nitride, add 77 parts of the above 30wt% toluene solution of macromolecular coupling agent after drying, ultrasonically disperse for half an hour, heat at 80°C for 3 hours, cool, put into methanol, and wash the resulting precipitate with methanol Several times, after drying, grind in a ball mill until the D50 is 1.5 μm to obtain modified aluminum nitride.

preparation example 2

[0040] Other conditions and steps are the same as in Preparation Example 1, except that monomer allyl polyoxyethylene ether is not added.

preparation example 3

[0042] Other conditions and steps are the same as in Preparation Example 1, except that the monomer vinyltrimethoxysilane is not added.

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Abstract

The invention provides a heat conduction type double-component pouring sealant, which is composed of a component A and a component B. The component A comprises the following raw materials by weight: 40-70 parts of vinyl silicone oil, 12-17 parts of a modified heat conduction filler, 8-15 parts of a reinforcing filler, 0.5-1 part of a catalyst, 0-11 parts of polyether modified silicone oil, and 0-20 parts of dimethyl silicone oil; the component B is prepared from the following raw materials in parts by weight: 30-50 parts of vinyl silicone oil, 13-22 parts of hydrogen-containing silicone oil, 12-17 parts of modified heat-conducting filler, 6-11 parts of polyether modified silicone oil, 0.5-1 part of an inhibitor, 0-11 parts of polyether modified silicone oil and 0-20 parts of dimethyl silicone oil; wherein the conditions are as follows: in the component A and the component B, the total amount of the dimethyl silicone oil is 15-20 parts, and the total amount of the polyether modified silicone oil is 6-11 parts; the modified heat-conducting filler is prepared from a macromolecular coupling agent and an inorganic heat-conducting filler. The pouring sealant provided by the invention canreduce the use amount of the inorganic heat-conducting filler, and the cured material still has excellent heat conductivity. Meanwhile, weather resistance, light transmittance, the mechanical property and the leveling property can meet the requirements.

Description

technical field [0001] The invention belongs to the field of adhesives, and in particular relates to a heat-conductive two-component potting adhesive and a preparation method thereof. Background technique [0002] Potting glue, used for bonding, sealing, potting and coating protection of electronic components. The potting glue is liquid before it is cured and has fluidity. The viscosity of the glue varies according to the material, performance and production process of the product. After the potting glue is cured, it can play the role of waterproof, moisture-proof, dust-proof, insulation, heat conduction, confidentiality, corrosion resistance, temperature resistance and shock resistance. There are many types of electronic potting adhesives. In terms of material types, the most commonly used are three types, namely epoxy resin potting adhesives, silicone resin potting adhesives, and polyurethane potting adhesives. Among them, the two-component silicone potting adhesive has ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J183/07C09J183/05C09J11/04C09J11/08
CPCC08K2003/2227C08K2003/265C08K2003/282C08K2201/005C08L2203/20C08L2205/025C08L2205/035C09J11/04C09J11/08C09J183/04C08L83/04C08K9/08C08K3/28C08K3/22C08K9/04C08K3/26
Inventor 姬振行王少华张海凤王宇川
Owner 中电保力(北京)科技有限公司
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