Semiconductor packaging equipment and packaging process thereof

Abstract

The invention discloses semiconductor packaging equipment and a packaging process thereof. The equipment comprises a bottom plate and a shell; a damping mechanism is arranged between the bottom plateand the shell, a working chamber is arranged in the shell, an air inlet is formed in the inner top of the working chamber, a dust filtering net is installed in the air inlet, and a folding air bag isarranged between the shell and the bottom plate. The upper end and the lower end of the folding air bag are fixedly connected with the lower end of the shell and the upper end of the bottom plate respectively, a pressure storage cavity is formed in the shell, the upper end of the folding air bag is communicated with the working chamber through an air inlet pipe, the lower end of the folding air bag is communicated with an air outlet pipe, and one-way valves are installed in the air inlet pipe and the air outlet pipe respectively. The semiconductor packaging equipment is provided with the damping mechanism, and the shaking generated when the equipment works can be reduced, so the service life of the equipment is prolonged; meanwhile, the dust removal mechanism is further arranged, the dustcontent in air in a working chamber can be reduced, and the final quality of a packaged semiconductor is improved.

Description

technical field [0001] The invention relates to the field of semiconductor production, in particular to semiconductor packaging equipment and a packaging process thereof. Background technique [0002] A semiconductor is a substance whose conductivity is between an insulator and a conductor. Its conductivity is easy to control and can be used as a component material for information processing. From the perspective of technology or economic development, semiconductors are very important. After the production of semiconductors is completed For one-time packaging, for the current packaging equipment and processes for semiconductors, there are the following problems when using them; [0003] 1. The existing semiconductor packaging equipment generally does not have a shock-absorbing mechanism, and during the semiconductor packaging process, the work of the electrical components inside will cause the equipment to shake, and long-term shaking will affect the internal components of t...

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Problems solved by technology

[0003] 1. The existing semiconductor packaging equipment generally does not have a shock-absorbing mechanism, and during the semiconductor packaging process, the work of the electrical components inside will cause the equipment to shake, and long-term shaking will affect the internal components of the equipment. The service life is not conducive to the packaging of semiconductors;

[0004] 2. In order to ensure the heat dissipation of the equipment, ventilation holes are generally provided on the equipment to dissipate heat through passive heat dissipation. During heat dissipation, it is easy to suck the dust from the outside into the working room, and the dust accumulated in the working room will affect the semiconductor after packaging. quality

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