U-W-N ternary thin film as well as preparation method and application thereof
A U-W-N, thin-film technology, applied in nuclear reactors, fusion reactors, thermonuclear fusion reactors, etc., can solve problems such as limited ability to suppress stimulated Brillouin scattering, complex structural layers of uranium black cavity, and easy excitation of epithermal electrons, etc., to achieve Effects of suppressing M-band hard X-rays and epithermal electron yield, protecting uranium black cavity conversion layer, good interfacial bonding force and chemical compatibility
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specific Embodiment approach 1
[0008] Specific Embodiment 1: This embodiment is a U-W-N ternary film, which is characterized in that the mass fraction of N in the U-W-N ternary film is x%, and 0<x≤66.7, and the mass fraction of W is y%, and 0< y≤10%, the remainder is U, and the thickness of the U-W-N ternary thin film is 100nm-700nm.
specific Embodiment approach 2
[0009] Specific Embodiment Two: This embodiment is a method for preparing a U-W-N ternary thin film, which is specifically completed in the following steps: using a DC reactive magnetron sputtering co-deposition method, using Ar as a protective gas, and using N 2 As the reaction gas, the U-W-N ternary film is obtained by magnetron sputtering deposition with the U target and the W target through a DC power supply, the purity of the U target is >99%, the purity of the W target is >99.99%, and the Ar Purity>99.9999%, the N 2 The purity of >99.9999%.
specific Embodiment approach 3
[0010] Specific embodiment three: the difference between this embodiment and specific embodiment two is: the specific process of the described DC reactive magnetron sputtering co-deposition method is as follows:
[0011] 1. Install 1 to 9 mandrels on the rotating support table, adjust the distance between the U target and the center of the mandrel to 10cm to 20cm, and the normal line of the U target center and the plane where the mandrel is located form an angle of 45°; adjust the W target and the plane where the mandrel is located. The center distance of the mandrel is 10cm-20cm, and the center normal of the W target surface and the plane where the mandrel is located form an angle of 45°; the normals of the U target and W target and the plane where the mandrel is located are symmetrically distributed;
[0012] 2. Vacuumize the deposition chamber by mechanical pump and molecular pump to make the vacuum degree of the deposition chamber reach 1×10 -8 Pa~1×10 -6 Pa, then fill in...
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