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A kind of epoxy resin adhesive for electronic device and preparation method thereof

A technology for epoxy resin glue and electronic devices, applied in the direction of epoxy resin glue, novolac epoxy resin adhesive, adhesive, etc., can solve the problem of long curing time of epoxy resin glue, low degree of crosslinking of polymerization network, Solve problems such as harsh curing conditions, achieve the effect of shortening the molding cycle, increasing the curing rate, and improving the mechanical strength

Active Publication Date: 2022-05-31
郯城博化化工科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to solve the technical problems of long curing time, harsh curing conditions, short gel time and low degree of crosslinking of the polymerization network in the prior art, the present invention provides an epoxy resin with simple synthesis process, fast curing speed and no curing after curing. Transparent epoxy resin glue and preparation method thereof

Method used

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  • A kind of epoxy resin adhesive for electronic device and preparation method thereof
  • A kind of epoxy resin adhesive for electronic device and preparation method thereof
  • A kind of epoxy resin adhesive for electronic device and preparation method thereof

Examples

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Embodiment 1

[0037] The epoxy resin glue of the present invention is used after mixing the A and B components. The epoxy resin glue of the present invention does not require special equipment

Embodiment 2

Embodiment 3

[0055] The amine compound is diethylenetriamine.

[0066] The epoxy resin glue of the present invention is used after mixing components A and B evenly. The epoxy resin glue of the present invention does not require special equipment

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Abstract

The invention discloses an epoxy resin adhesive for electronic devices, which belongs to the technical field of adhesives. The epoxy resin glue of the present invention comprises A component and B component, wherein A component is 25-35 parts of composite ionic liquid curing agent; B component is: epoxy resin 65-75 parts, accelerator 0-2 part, 0-2 parts of thinner, 0-2 parts of plasticizer and 0-1 part of filler. The epoxy resin glue prepared by the invention has a long service life and high reactivity, and can be quickly cured within 3 minutes at room temperature, which significantly shortens the molding cycle and fully meets the production efficiency requirements of the rapid manufacturing technology in the field of bonding electronic devices.

Description

Epoxy resin glue for electronic devices and preparation method thereof technical field The invention belongs to adhesive technical field, be specifically related to a kind of epoxy resin glue for electronic device and preparation method thereof Law. Background technique Epoxy resin curing is often used as an adhesive for electronic devices, because the circuit boards, screens of computers, mobile phones, cameras, etc. It cannot withstand high temperature when the device is bonded, so the curing condition of the adhesive is required not to be high temperature. Significant effects of thiol curing agents One of the advantages is that epoxy resin can be cured at room temperature or even low temperature, which can be widely used as epoxy curing agent for electronic adhesives. chemical agent. Chinese patent CN201910544925 discloses a kind of technology of synthesizing the epoxy glue of low temperature fast curing, with sulfur Alcohol is the curing agent. As an adhesiv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/04C09J163/02C09J163/00C08G59/66C08G59/56
CPCC09J163/04C09J163/00C08G59/66C08G59/56Y02P20/54
Inventor 李佳林张洁金君素王宇博
Owner 郯城博化化工科技有限公司
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