Radiant floor heating structure

A floor heating and floor heating pipe technology, applied in building structure, hot water central heating system, heating method, etc., can solve the problems of high professional requirements of construction personnel, complicated, long construction period of wet floor heating, etc., and achieve excellent compressive performance. and bending resistance, less material and lighter weight

Pending Publication Date: 2020-10-16
SHANGHAI XINGYE MATERIALS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the wet floor heating has a long construction period and requires high professionalism of the construction personnel. Once the water pipe or electric heating film buried under the surface is damaged, the concrete filling layer must be removed, which is very complicated

Method used

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  • Radiant floor heating structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] Figure 1 to Figure 4 A preferred embodiment of the floor heating structure of the present application is shown, which includes a floor heating pipe 1 for running hot water and a plurality of floor boards 2 above the floor heating pipe.

[0056] The key improvement of this embodiment is that each floor board 2 is composed of a metal corrugated board 201 , a panel 202 attached to and fixed on the top of the metal corrugated board, and a floor buckle 203 fixedly connected to the side of the metal corrugated board. The metal corrugated board 201 is laid on the floor heating pipe 1 and is thermally connected with the floor heating pipe 1 , and the floor boards 2 are connected by floor buckles 203 that are fastened to each other.

[0057] It can be seen that each floor plate 2 of this floor heating structure is directly paved above the floor heating pipe 1, and each floor plate 2 is connected to each other by means of the floor buckle 203 that comes with the floor plate 2 to...

Embodiment 2

[0081] Image 6It shows the second preferred embodiment of the floor heating structure of the present application, the floor heating structure is basically the same as the structure of the first embodiment, the difference is that the length of the heat pipe clamp 4 in this embodiment is basically equal to the length of the floor heating pipe 1 .

Embodiment 3

[0083] Figure 7 It shows the third preferred embodiment of the floor heating system of the present application. The structure of the floor heating system is basically the same as that of the first embodiment. The upper surface is covered with a layer of heat-conducting film 7, and part of the heat-conducting film 7 is sandwiched between the outer pipe wall of the floor heating pipe 1 and the groove wall of the pipe groove 301, and the metal corrugated board 201 (specifically, the lower plate body 201b) is attached to Arranged on the upper surface of the heat conduction film 7 . In this way, the heat conduction film 7 has a larger contact area with the floor heating pipe 1 and the metal honeycomb panel 201 , so that the heat of the floor heating pipe 1 can be quickly transferred to the metal honeycomb panel 201 .

[0084] The above-mentioned heat conduction film 7 is preferably aluminum foil.

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PUM

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Abstract

This application relates to a radiant floor heating structure with low energy consumption, instant-open instant-heating, adoption of full-dry construction and no scale formation. The structure comprises radiant floor heating pipes for running hot water and multiple floor blocks located above the radiant floor heating pipes, wherein each floor block is composed of a metal corrugated board, a panelfixed on the panel of the metal corrugated board, and a floor buckle fixedly connected to the side of the metal corrugated board; the metal corrugated boards are laid on the radiant floor heating pipes and are thermally connected to the radiant floor heating pipes; and multiple floor blocks are connected to the floor buckles by means of mutual buckling.

Description

technical field [0001] This application relates to the field of floor heating. Background technique [0002] Floor heating is the abbreviation of radiant floor heating. It is Radiant Floor Heating in English. It uses the whole ground as a radiator, heats the whole ground evenly through the heat medium in the radiant layer of the floor, and supplies heat to the room through the heat transfer mode of radiation and convection through the ground. , to achieve the purpose of comfortable heating. According to different heat transfer media, it can be divided into water floor heating and electric floor heating. [0003] Water floor heating refers to a heating method that heats water to a certain temperature, transports it to the water pipe cooling network under the floor, and realizes the purpose of heating through floor heating. [0004] Electric floor heating is a translucent polyester film that can generate heat after being energized. It is made of conductive special ink and me...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04F15/02E04F15/04E04F15/08E04F15/10E04F15/18F24D3/12
CPCE04F15/02E04F15/02038E04F15/041E04F15/082E04F15/105E04F15/107E04F15/18E04F2201/026E04F2201/042E04F2201/044E04F2290/04E04F2290/047F24D3/12F24D3/122
Inventor 高峰刘在祥陈艳凤蔡园丰王兵牛争艳
Owner SHANGHAI XINGYE MATERIALS TECH CO LTD
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