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Silicon crystal groove type wet texturing circulating filtration treatment method

A technology of circulating filtration and treatment method, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc. It can solve problems such as inability to effectively reduce concentration and viscosity, inability to effectively remove liquid medicine, and weakened cleaning ability, so as to improve cleaning ability , save the amount, remove the effect of metal contamination

Pending Publication Date: 2020-10-13
BAODING GUANGWEI GREEN ENERGY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the cleaning tank after texturing, the silicate compounds and complexes gradually increase after the silicon wafer enters, and the cleaning ability is weakened, resulting in incomplete cleaning in the later stage of texturing, resulting in pollution of silicate compounds and complexes. And at present, the depth of the texture pit exceeds 300nm, the opening is small, and the texture is rough
When the concentration of silicate compounds and complexes is high and the viscosity is high, the concentration and viscosity cannot be effectively reduced by bubbling and circulation, resulting in the inability to effectively remove the liquid in the later stage

Method used

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  • Silicon crystal groove type wet texturing circulating filtration treatment method
  • Silicon crystal groove type wet texturing circulating filtration treatment method
  • Silicon crystal groove type wet texturing circulating filtration treatment method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Embodiment 1: A kind of silicon crystal tank type wet texturing circulation filtration treatment method,:

[0036] Include the following steps:

[0037] D1. Initial alkaline cleaning: Insert the silicon wafer into the flower basket, enter the initial alkaline cleaning for removing silicon compounds and contamination on the surface, put the silicon wafer into the alkaline cleaning tank with alkaline cleaning solution, and the alkaline cleaning solution has a weight ratio of The composition of H2O and H2O2 is 20:1. The alkaline cleaning tank and the alkaline cleaning tank source used to provide the alkaline cleaning tank form a circulating liquid supply. The liquid inlet of the alkaline cleaning tank is provided with a filter element for filtering the alkaline cleaning tank. The initial alkali The cleaning time is usually ten minutes, and the cleaning liquid is kept circulating and filtered during the alkali cleaning process. The filter element is 5-50um, the diameter of ...

Embodiment 2

[0045] Embodiment 2: A kind of silicon crystal tank type wet texturing circulation filtration treatment method,:

[0046] Include the following steps:

[0047] D1. Initial alkaline cleaning: insert the silicon wafer into the flower basket, enter the initial alkaline cleaning for removing silicon compounds and stains on the surface, put the silicon wafer into the alkaline cleaning tank with alkaline cleaning solution, and the initial alkaline cleaning usually lasts for ten minutes .

[0048] D2. Alkali polishing, for surface polishing.

[0049] S1. Texture making, configure texturing liquid, put the silicon wafer into the texturing liquid and let it stand until the depth of the corrosion pit of the silicon wafer reaches 200-700nm, the width of the corrosion pit reaches 400-1200nm, and take out the silicon wafer;

[0050] S2. washing for the first time, the silicon wafer is placed in a cleaning tank with cleaning solution, and the washing time is usually 25 minutes;

[0051] ...

Embodiment 3

[0059] Embodiment 3: A kind of silicon crystal tank type wet texturing circulation filtration treatment method,:

[0060] Include the following steps:

[0061] D1. Initial alkaline cleaning: Insert the silicon wafer into the flower basket, enter the initial alkaline cleaning for removing silicon compounds and contamination on the surface, put the silicon wafer into the alkaline cleaning tank with alkaline cleaning solution, and the alkaline cleaning solution has a weight ratio of The composition of H2O and H2O2 is 20:1. The alkaline cleaning tank and the alkaline cleaning tank source used to provide the alkaline cleaning tank form a circulating liquid supply. The liquid inlet of the alkaline cleaning tank is provided with a filter element for filtering the alkaline cleaning tank. The initial alkali The washing time is usually ten minutes.

[0062] D2. Alkali polishing, configure the KOH (NOH) and H2O liquid medicine with a weight ratio of 3:10 for surface polishing, the polis...

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Abstract

The invention discloses a silicon crystal groove type wet texturing circulating filtration treatment method, and belongs to the field of silicon unit treatment processes. The method comprises: S1, texturing, S2, first-time water washing, S3, alkali washing, S4, second-time water washing, S5, acid pickling and S6, dewatering and drying. The cleaning tank liquid medicine adopts a circulating filtration system, so that the accumulation of silicate compounds and complexes is effectively reduced, the consumption of chemicals is reduced, textured silicon wafers are cleaned, the influence of subsequent diffusion and sintering of high-temperature inorganic matters on photovoltaic cell carriers is avoided, and the prepared black silicon cell is high in filling degree and excellent in electrical property parameters.

Description

technical field [0001] The invention belongs to the technical field of silicon crystal processing methods, and in particular relates to a silicon crystal tank type wet texturing circulation filtration processing method. Background technique [0002] Since each tank of the tank-type texturing equipment used in the market is only designed to circulate bubbling function, after the silicon wafer reacts with the chemical liquid, the silicate compound and complex will remain in the chemical liquid tank. With the increase of the input amount of silicon wafer, the concentration of silicate compound and complex compound will increase, which will adhere to the surface of silicon wafer and is not easy to clean. In order to solve the accumulation of silicate compounds and complexes, the aggregation effect of metal ions, and avoid pollution, the routine treatment of silicate compounds and complexes is to replace the long-lived chemical solution and cleaning water in time, and extend the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/02
CPCH01L21/67086H01L21/67057H01L21/02019H01L21/02041
Inventor 方再华扬艳景韩光马艳林卢春伟亓延杰孙国栋
Owner BAODING GUANGWEI GREEN ENERGY TECH CO LTD
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