Method and structure used for board thermal insulation system falling, cracking and seepage repair reinforcing

Abstract

The invention discloses a method and structure used for board thermal insulation system falling, cracking and seepage repair reinforcing. A felt and glue composite layer or MFCT composite layer and anew facing layer form a surface anti-cracking and waterproof reinforcing protection layer, thermal insulation system area loads are converted into concentrated loads to be transmitted to a reinforcingpoint dedicated column part, the reinforcing point dedicated column part is combined with a dedicated injection opening anchor nail or a dedicated anchor nail and a foaming agent to form an organic whole stress column with an original thermal insulation system, the concentrated loads are transmitted to a foundation wall, a truss stress system is formed through combination to carry out original thermal insulation board falling, cracking and seepage repair and reinforcing, the bonding area of a thermal insulation board in the original thermal insulation system is increased, in the whole reinforcing process, no dripping or expansion deforming exists, the safety property, the anti-seismic property and the stability property after reinforcing and the supporting property after anchorage of thethermal insulation system can be improved, the quality is controllable, and meanwhile, the external thermal insulation anti-cracking waterproof property can be improved.

Description

technical field [0001] The invention relates to the technical field of building construction, in particular to a method and a structure for repairing and reinforcing the shedding, cracking and leakage of a plate insulation system. Background technique [0002] Under normal circumstances, the pasting methods of the external wall panel insulation system are divided into two types: point frame pasting and strip pasting, also known as point sticking and full sticking, with sticking as the main force and plastic anchor bolts as the supplement. In the northern region, the base of the outer wall is usually not painted and leveled, so the flatness of the base wall is poor. Usually, the point-stick method is used to paste the insulation board to solve the problem of the flatness of the outer insulation board. In addition, adhesive mortar is used as the leveling material at the point sticking point, so that the bonding area between the insulation board and the foundation wall is often...

AI Technical Summary

Problems solved by technology

[0009] One of the technical problems to be solved by the present invention lies in the existence of repair and reinforcement methods for the existing plate heat preservation system falling off, cracking and leakage: there is no adhesive layer under the base of the heat preservation anchor bolt, and there is no support and constraint in the cavity of the anchor bolt. Due to the weight of the insulation system, wind and earthquake effects, it is easy to deform, the anchorage is unstable, the reliability is poor, the pulling force of a single nail is low, the quality is uncontrollable and unguaranteed, and the reinforcement effect is poor

[0010] The second technical problem to be solved by the present invention lies in the existence of repair and reinforcement methods for the existing board heat preservation system falling off, cracking and leakage: there is no adhesive layer under the base of the heat preservation anchor bolt, and there is no support and constraint in the cavity of the anchor bolt. Due to the weight of the insulation system, wind and earthquake effects, it is easy to deform, the anchorage is unstable, the reliability is poor, the pulling force of a single nail is low, the quality is uncontrollable and unguaranteed, and the reinforcement effect is poor

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