Preparation method of wave absorbing body, wave absorbing body and application of wave absorbing body

Abstract

The invention discloses a preparation method of a wave absorbing body, wherein the raw materials of the wave absorbing body comprise wave absorbing agent powder and a thermoplastic polymer which are uniformly mixed. According to the method, by using a pre-created wave absorbing body three-dimensional graph as a forming target, the wave absorbing body three-dimensional graph is decomposed into a multilayer two-dimensional structure with a target thickness; the raw materials of the wave absorbing body are heated and melted through rapid forming equipment while a magnetic field with the magneticline parallel to the two-dimensional structure is applied so as to bond and coat the wave absorbing agent powder with the thermoplastic polymer; and the bonded and coated wave absorbing agent powder is arranged in parallel under the action of the magnetic field, and a wave absorbing body with a three-dimensional structure is obtained through molding. The embodiment of the invention further discloses a wave absorbing body and application thereof. The preparation process is simple, large-scale production is easy to realize, the prepared wave absorbing body has a three-dimensional structure, a splicing structure of a planar wave absorbing body is avoided, the thickness is adjustable, the shape is regularly arranged in parallel, and the wave absorbing body has an excellent electromagnetic waveshielding function.

Description

technical field [0001] The invention belongs to the field of wave-absorbing materials, and in particular relates to a method for preparing a wave-absorbing body. The invention also relates to a wave-absorbing body obtained by the preparation method and its application. Background technique [0002] With the rapid development of electronic products, affected by the trend of high frequency and high integration, the problem of electromagnetic wave interference between various components is becoming more and more serious. Because the absorber material can absorb electromagnetic waves instead of reflecting them, it has the irreplaceable advantages of other conductive shielding materials. Therefore, in order to reduce electromagnetic wave interference, absorber materials are more and more widely used in electronic products. Specifically, among all kinds of absorber materials, soft magnetic alloys are widely used in electronic equipment because of their high magnetic saturation str...

AI Technical Summary

Problems solved by technology

However, this preparation method and the obtained absorbing coating have the following disadvantages: (1) a large amount of solvent is used in the preparation process; (2) the thickness is limited, usually not greater than 0.5 mm; (3) only a flat surface can be obtained shaped coating

[0004] However, in practical application scenarios, absorbers with greater thickness are sometimes required to achieve better shielding effects. At the same time, the protection of planar absorbing coatings for three-dimensional components needs to be achieved by splicing and pasting. Its seams inevitably increase the risk of leakage

[0005] Moreover, the applicant searched through patents and found that it was proposed to use magnetic field rotation orientation for pretreatment and then press molding to obtain a 3D effect absorber. The process of magnetic field rotation orientation is particularly complicated, and the 3D effect absorber obtained by pressing cannot realize the Arranged in parallel, electromagnetic wave shielding is limited (see CN104319050A directly); it is also proposed to carry out magnetic field orientation during the pressing process, and then cut layer by layer, and then stack and form. This cutting process is very time-consuming and labor-intensive, and it is difficult to realize industrial promotion (directly refer to CN107256751A)

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