A cross-node in-band heat dissipation control method and device

A cross-node and controller technology, applied in instruments, computing, electrical digital data processing, etc., can solve the problems of many cables, poor autonomy, low stability, etc., to avoid additional cables, reduce additional costs, improve Working stability and effectiveness

Active Publication Date: 2022-04-29
INSPUR SUZHOU INTELLIGENT TECH CO LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

One method is to add a BMC to the storage node to achieve control, but it will increase a lot of cost; the other method is to hand over the heat dissipation control of the storage node to the BMC of the computing node, and pull the management signals such as PWM of the BMC to the storage node. Node mode or BMC-I2C-storage node CPLD mode, but this method requires additional management cables, and it is difficult to achieve real-time cooling control when the BMC hangs up
[0004] There is currently no effective solution to the problems of high cost of cross-node heat dissipation control, many cables, low stability, and poor autonomy in the existing technology

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A cross-node in-band heat dissipation control method and device
  • A cross-node in-band heat dissipation control method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049] In order to make the object, technical solution and advantages of the present invention clearer, the embodiments of the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0050] It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are to distinguish two entities with the same name but different parameters or parameters that are not the same, see "first" and "second" It is only for the convenience of expression, and should not be construed as a limitation on the embodiments of the present invention, which will not be described one by one in the subsequent embodiments.

[0051] Based on the above purpose, the first aspect of the embodiment of the present invention proposes a cross-node in-band heat dissipation control method that can reduce additional costs, avoid the use of additional cables, improve work stability ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a cross-node in-band heat dissipation control method and device. The method includes: sending a first instruction for acquiring temperature information of a storage node by a baseboard management controller of a computing node; The serial connection SCSI expander chip sent to the storage node through the serial connection SCSI data link; the temperature information of the storage node is obtained by the serial connection SCSI expander chip and fed back to the baseboard management controller; the baseboard management controller According to the temperature information of the storage node, it is determined that the second instruction for controlling the working intensity of the fan of the storage node is transmitted to the serial connection SCSI expander chip; the second instruction is sent to the fan of the storage node complex by the serial connection SCSI expander chip Logic programmable device to control the working intensity of the fan. The invention can reduce extra cost, avoid using extra cables, improve work stability and self-control ability of storage nodes.

Description

technical field [0001] The present invention relates to the field of heat dissipation control, and more specifically, to a cross-node in-band heat dissipation control method and device. Background technique [0002] In the development of server cabinets, the combination of computing nodes and storage nodes is becoming more and more popular, and the corresponding heat dissipation management and control methods are gradually attracting attention. At present, servers usually use air cooling to dissipate heat, and a management chip implements a fan control strategy to meet heat dissipation requirements. [0003] In the architecture where computing nodes are paired with storage nodes, computing nodes usually use BMC to control fans, while heat dissipation of storage nodes becomes a problem. One method is to add a BMC to the storage node to achieve control, but it will increase a lot of cost; the other method is to hand over the heat dissipation control of the storage node to the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 邹志鑫
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap