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A wafer cleaning device

A technology for cleaning devices and wafers, applied in cleaning methods and tools, cleaning methods using liquids, cleaning methods using tools, etc., can solve problems affecting wafer quality, easily scratching wafers, and high labor intensity. Achieve the effect of unaffected quality and pass rate, clean and thorough brushing, smooth and reliable sliding

Active Publication Date: 2020-12-01
SHANDONG NOVOSHINE OPTOELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Specifically, the technical problem to be solved by the present invention is: to provide a wafer cleaning device to solve the problem of manual wafer single-chip cleaning at present, which has low cleaning efficiency, high labor intensity, and is easy to scratch the wafer, affecting the quality of the wafer. quality technical issues

Method used

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  • A wafer cleaning device
  • A wafer cleaning device
  • A wafer cleaning device

Examples

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Embodiment Construction

[0049] The present invention will be further described below in conjunction with specific examples. However, the uses and purposes of these exemplary embodiments are only used to illustrate the present invention, and do not constitute any form of limitation to the actual protection scope of the present invention, nor limit the protection scope of the present invention thereto.

[0050] Such as Figure 1 to Figure 9 Commonly shown, this embodiment provides a wafer cleaning device, including a cleaning workbench 1, a cleaning box 2 is fixedly installed on the cleaning workbench 1, and a strip-shaped wafer pick-and-place opening is provided on one side of the cleaning box 2 201, so as to facilitate the picking and placing of wafers in the cleaning box 2.

[0051] The bottom of the cleaning workbench 1 is slidably installed with the installation frame 5 driven by the first drive device in the vertical direction, and the vacuum tube 7 driven by the second drive device is rotated o...

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Abstract

The invention belongs to the technical field of wafer production and processing, and provides a wafer cleaning device, which comprises a cleaning workbench, wherein a cleaning box is installed on thecleaning workbench, a wafer taking and placing opening is formed in one side of the cleaning box, an installation frame driven by a first driving device is installed below the cleaning workbench in asliding mode, a vacuum pipe driven by a second driving device is rotationally installed on the installation frame, a Bernoulli sucking disc is installed at the top end of the vacuum pipe, a lower mounting plate driven by a third driving device is further slidably mounted on the cleaning workbench, an upper mounting plate driven by a fourth driving device is slidably mounted on the lower mounting plate, one end of the upper mounting plate extends into the cleaning box and is rotatably provided with a rotating shaft driven by a fifth driving device, and a sponge brush head is fixedly mounted atthe bottom end of the rotating shaft. According to the invention, automatic scrubbing of the wafer is achieved, the scrubbing efficiency is greatly improved, scrubbing is clean and thorough, secondarypollution and scratching cannot be caused to the wafer, and it is guaranteed that the quality and the percent of pass of the wafer are not affected in the scrubbing process.

Description

technical field [0001] The invention relates to the technical field of wafer production and processing, in particular to a wafer cleaning device. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. With the continuous shrinking of the critical dimensions of semiconductor devices and the introduction of new materials, during the production and processing of wafers, the requirements for the cleanliness of the wafer surface are becoming more and more stringent, and multiple cleanings are usually required to remove Attached dirt and process fluid. [0003] At present, the cleaning of wafers is usually divided into two methods: tank cleaning and single-chip cleaning; tank cleaning is to put the wafer in the cleaning tank for cleaning, which can realize the cleaning of several wafers at the same time, with high cleaning efficiency , but the cleaning effect on ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/683B08B1/00B08B1/02B08B3/02B08B3/08
CPCB08B1/006B08B1/02B08B3/022B08B3/08H01L21/67046H01L21/67051H01L21/6838
Inventor 赵成浩李凯杰郭明灿王子龙
Owner SHANDONG NOVOSHINE OPTOELECTRONICS CO LTD
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