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A kind of electronic material cutting cold processing fixed condensate and device

An electronic material and condensate technology, which is applied in stone processing equipment, fine working devices, manufacturing tools, etc., can solve the problems of difficulty in meeting the diversification of the size of the cut products, the temperature rise of the solidified layer of the cutting tool, and the unstable fixation. Achieve the effect of ensuring processing quality, reducing processing costs, and meeting the needs of energy conservation and environmental protection

Active Publication Date: 2022-03-15
UNIV OF ELECTRONICS SCI & TECH OF CHINA +1
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a kind of electronic material cutting and cold processing fixing condensate and device, which is used to solve the problem that the current vacuum adsorption fixing method for cutting processing is difficult to meet the diversification of the size of the cut product, and the cutting tool will generate heat during processing. The problem that the temperature of the solidification layer rises and melts, causing the fixation to become unstable

Method used

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  • A kind of electronic material cutting cold processing fixed condensate and device

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Effect test

Embodiment 1

[0030] In this embodiment, the fixed condensate adopts dimethyl sulfoxide and 10 -6 mol / L thiocyanate, when cutting electronic ceramic materials, the electronic components will not be damaged due to the shaking of the plate during processing, and the scrap rate is low.

[0031] Lay the electronic material to be cut into the processing tank 7, and inject the condensate solution into the avoidance tank 8 through the fixed condensate storage device 3 when the temperature is higher than the condensation temperature. The condensate solution covers the surface of the electronic material, and the temperature adjustment device 2 is activated. , so that the fixed condensate is cooled below the condensation temperature (14-19°C), the solution is solidified, and the electronic material is cut after the cutter head is aligned accurately; while processing, cooling water is used to cool the cutter at 1-8°C The circulating cooling water of the cutter head can effectively avoid the problem th...

Embodiment 2

[0035] In the present embodiment, the fixed condensate adopts glacial acetic acid and dimethyl sulfoxide and 10 -6 mol / L 2-mercapto-5-methyl-1,3,4-thiadiazole, wherein the mixing ratio of dimethyl sulfoxide and glacial acetic acid is 90:1, and its machining process is as in Example 1 shown.

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Abstract

The invention belongs to the field of electronic materials and components, and specifically provides a cutting and cold processing and fixing condensate and device for electronic materials, which are used to solve the problem that the current vacuum adsorption and fixing method for cutting processing is difficult to meet the diversification of the sizes of cut products. The solidification temperature of the fixed condensate provided by the present invention is 14-19°C. After solidification, the matching auxiliary anti-skid block can have a good fixing and shock-absorbing effect on electronic material parts, so that it can meet the processing requirements of electronic material parts of different sizes; at the same time , the matching processing device uses tap water to cool down the cutter head cooling device and then controls the temperature of the running cutter. The cutter cooling water at 1-8°C can effectively prevent the temperature of the solidified layer from rising and melting, resulting in unstable fixation. The problem of stability; in summary, the present invention can meet the processing requirements of electronic material parts of different sizes, and not only improve the processing efficiency, but also better guarantee the processing quality and greatly reduce the processing cost.

Description

technical field [0001] The invention belongs to the field of electronic materials and components, and relates to a condensate for the fixing and cutting technology of electronic materials and components, in particular to a condensate and a device for cutting and cold processing and fixing electronic materials. Background technique [0002] The 21st century is the era of information. As the carrier of information, electronic materials and components are widely used in various fields of production and life; Precision machining of devices is becoming more and more urgent and important. [0003] Some precision electronic materials and components need to be fixed by vacuum adsorption. For example, when cutting the block, it is necessary to vacuum the block to fix it on the workbench to facilitate cutting by the cutter; The area of ​​the block should not be too small. The general control cutting product size is: 75 mm × 75 mm ~ 210 mm × 210 mm. Offset is easy to occur; and as th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/00C10M169/04C10N30/12
CPCB28D5/00B28D5/0076C10M169/04C10M2219/0406C10M2207/122C10M2219/106C10M2219/09
Inventor 李元勋李勤华陶志华苏桦徐雷张仕俊韩莉坤
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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