Method for making thick copper circuit board and thick copper circuit board

Abstract

The invention discloses a method for manufacturing a thick copper circuit board and the thick copper circuit board. The manufacturing method includes the following steps: according to the panel size, a thick copper foil with a thickness ≥ 12 oz, a thin copper foil with a thickness of 0.5 oz, a bare board, Auxiliary board and PP; After forming a circuit pattern on the first surface of the thick copper foil through a negative film process, etch out an inner layer circuit with half its thickness, and retreat the film, and fill the gap between the circuit patterns with resin; the auxiliary board It is riveted together with thick copper foil, and then the corresponding inner layer circuit is made on the second surface through the negative film process, and the gap between the circuit patterns is filled with resin, and then the auxiliary board is removed; thick copper foil and PP and light board After stacking, press to form a thick copper inner layer board, then laminate the thick copper inner layer board with thin copper foil and PP and press to form a thick copper multilayer printed board; finally, the thick copper multilayer printed board passes through the After the process, a thick copper circuit board is obtained. The method of the invention can realize the production of thick copper circuit boards with inner layer copper thickness ≥ 12 oz and line width and line gap ≤ 0.7 mm.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for producing a thick copper circuit board and the thick copper circuit board. Background technique [0002] Thick copper circuit board refers to a type of product in which the copper thickness of the inner layer and / or outer layer is thicker than that of conventional circuit boards. It is used to carry large currents, dissipate heat and reduce thermal strain. It is mostly used in communication equipment, aerospace, and networks. Energy, new energy vehicle power supply, etc. [0003] Due to the special structure of thick copper circuit boards, in addition to certain particularities in material selection, many manufacturing processes also have unique features, which become technical difficulties, such as etching of thick copper circuit boards. During the etching process of the circuit board, the etching solution not only etches the copper surface...

AI Technical Summary

Problems solved by technology

[0004] At present, the commonly used etching method for thick copper circuit boards is to use two etchings and change the up and down directions of the thick copper circuit boards during the two etchings, so that the two surfaces of the thick copper circuit boards face downward for one time to receive the etching solution from the bottom. Spray upwards and accept the spraying of etchant from top to bottom once facing upwards, so that the outer layer of the thick copper circuit board can be etched uniformly, and the areas with dense lines can be etched clean, while preventing excessive etching in areas with few lines. The problem of thin etching lines; however, the existing etching technology for thick copper circuit boards can only meet the etching requirements of mildly thick copper circuit boards. For thicker copper circuit boards, such as copper thickness ≥ 12OZ, the line width and gap are uniform Circuit boards below ≤0.7mm cannot be produced due to the existence of etching factors