Microwave chip eutectic welding platform and eutectic welding method

A microwave chip, eutectic welding technology, applied in the manufacture of electrical components, electric solid-state devices, semiconductor/solid-state devices, etc., can solve the problems of poor clamping stability and inflexible switching of small-sized metal carriers, and achieve flexible conversion of fixed positions. , the effect of simple fixation and high versatility

Pending Publication Date: 2020-08-11
MT MICROSYST
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Problems solved by technology

[0004] The purpose of the present invention is to provide a microwave chip eutectic welding platform and eutectic welding method, aiming to solve the problem of inflexible switching of different sizes of metal carriers in microwave chip manual friction eutectic welding tooling and small size metal carriers. The problem of poor clamping stability

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[0036] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0037] Please also refer to figure 1 , Figure 3 to Figure 5 , the microwave chip eutectic soldering platform provided by the present invention will now be described. The microwave chip eutectic welding platform includes a housing 100, a heating platform 200 and a working platform 300; the top of the housing 100 is open; the heating platform 200 is located inside the housing 100 for electrical connection with an external power supply; the working platform 300 is located inside the housing 100, and the bottom surface is attached to the top surface of the heating p...

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Abstract

The invention provides a microwave chip eutectic welding platform and a eutectic welding method, and belongs to the technical field of chip packaging. The microwave chip eutectic welding platform comprises a shell, a heating platform and a working platform, wherein the top end of the shell is open, the heating platform is arranged in the shell and used for being electrically connected with an external power source, the working platform is arranged in the shell, the bottom face of the working platform is attached to the top face of the heating platform, a plurality of working areas are arrangedon the top surface of the working platform and are respectively used for sticking metal carriers with different sizes, vacuum adsorption holes used for being communicated with a vacuum pump pipelineare formed in the multiple working areas respectively, the vacuum adsorption holes are used for adsorbing the metal carriers, and the hole sizes of the vacuum adsorption holes in all the working areasare in direct proportion to the sizes of the attaching faces of the metal carriers. The microwave chip eutectic welding platform provided by the invention is suitable for welding operation of different types of microwave chips. The invention further provides an eutectic welding method.

Description

technical field [0001] The invention belongs to the technical field of chip packaging, and more specifically relates to a microwave chip eutectic welding platform and a eutectic welding method. Background technique [0002] Eutectic soldering is a common microwave chip packaging process. By heating and melting the solder sheet at a high temperature, a eutectic alloy is formed between the chip and the metal carrier, thereby connecting them as one. There are three common eutectic welding methods for microwave chips, namely vacuum eutectic welding using a vacuum packaging furnace, automatic friction eutectic welding using a placement machine, and manual friction eutectic welding by holding the chip with tweezers. The first two methods require The equipment is expensive, and it is necessary to customize fixtures for different types (sizes) of microwave chips, so there are problems of poor versatility, high cost, and long cycle time. For the production needs of multiple varieties...

Claims

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Application Information

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IPC IPC(8): H01L21/60
CPCH01L24/75H01L24/77H01L24/83H01L24/84H01L2224/7515H01L2224/7715H01L2224/8302H01L2224/8402
Inventor 王伟强刘健魏泽超许鹏李旭浩
Owner MT MICROSYST
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