Air particle dust pumping and discharging device and method of polishing equipment

Abstract

The invention provides an air particle dust pumping and discharging device of polishing equipment. The device ensures that when air particle dust is pumped and discharged out of a polishing machine, the scratching rate of a polishing disc is low, and the polishing yield of a submerged wafer is improved. A polishing equipment base is involved, a fixed disc turntable is arranged on the polishing equipment base, a ceramic disc wafer carrier is placed on the fixed disc turntable, the polishing equipment base is connected with an upper mounting frame through an upward convex arc plate, a pluralityof downward exposed polishing turntables are arranged on the upper mounting frame, the polishing turntable is used for polishing wafers on the ceramic disc wafer carrier, and at least one pumping anddischarging air port is formed in an arc plate. Each pumping and discharging air port is externally connected with an exhaust power device through an exhaust pipe, and an original vertical pumping anddischarging port is closed.

Description

technical field [0001] The invention relates to the technical field of exhaust devices for polishing machines, in particular to an air particle dust extraction device for polishing equipment. The invention also provides a method for extracting air particles and dust from polishing equipment. Background technique [0002] At present, the extraction devices of polishing machines sold and practical on the market are all designed to open upwards and be vertical to the top of the polishing disc, and there is a height distance of about 0.4 meters from the surface of the worktable, which makes it impossible to effectively remove the polishing machine during the extraction process. Particles in the air on the disc, during the exhausting process, the particles gather at the exhaust outlet, and enter the exhaust pipe from the exhaust outlet to be discharged. The larger particles are attached by the tension of the water in the polishing process, which increases the number of particles i...

AI Technical Summary

Problems solved by technology

[0002] At present, the extraction devices of polishing machines sold and practical on the market are all designed to open upwards and be vertical to the top of the polishing disc, and there is a height distance of about 0.4 meters from the surface of the worktable, which makes it impossible to effectively remove the polishing machine during the extraction process. Particles in the air on the disc, during the exhausting process, the particles gather at the exhaust outlet, and enter the exhaust pipe from the exhaust outlet to be discharged. The larger particles are attached by the tension of the water in the polishing process, which increases the number of particles in the air. The weight causes weightlessness and falls on the polishing disc, causing poor scratches during the polishing process and affecting the substrate wafer polishing yield

Images