An integrated circuit structure and its manufacturing method

An integrated circuit and manufacturing method technology, applied in the field of integrated circuit packaging, testing and manufacturing, can solve the problems of peeling off the substrate and the packaging layer, severe bending, substrate cracks, etc., so as to facilitate filling of conductive materials, prevent excessive stress, and prevent separation. layer effect

Active Publication Date: 2022-01-07
TIANJIN HENGLIYUANDA INSTR
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although this method can save vertical space and reduce the thickness of the package, the edge of the substrate 1 will be bent toward the opening of the groove 2 due to the heating effect in the subsequent packaging process.
If multiple devices are stacked, they will experience more thermal effects and may bend more severely, causing problems such as delamination of the substrate from the packaging layer and cracking of the substrate

Method used

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  • An integrated circuit structure and its manufacturing method
  • An integrated circuit structure and its manufacturing method
  • An integrated circuit structure and its manufacturing method

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Embodiment Construction

[0040] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Apparently, the described embodiments are some of the embodiments of the present disclosure, not all of them. Based on the described embodiments of the present disclosure, all other embodiments obtained by persons of ordinary skill in the art without creative effort fall within the protection scope of the present disclosure.

[0041] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those skilled in the art to which the present disclosure belongs. "First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importan...

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Abstract

The present invention provides an integrated circuit structure and its manufacturing method, which utilizes forming a first sealing layer in a substrate and forming a second sealing layer on the substrate, and making the first sealing layer and the second sealing layer both For the compressive stress, to counteract the warping force of the substrate. Moreover, the filling ratios of the inorganic fillers in the first sealing layer and the second sealing layer are different, so that the two have a difference in compressive stress, which can ensure that the substrate does not warp while ensuring the stability of the first sealing layer and the second sealing layer. Binding force.

Description

technical field [0001] The invention relates to the field of integrated circuit packaging, testing and manufacturing, in particular to an integrated circuit structure and a manufacturing method thereof. Background technique [0002] The existing embedded semiconductor integrated packaging structure is often in the form of embedding a chip by forming a groove on the substrate. For details, please refer to figure 1 . exist figure 1 Among them, the substrate 1 is a substrate with a relatively large area, which can integrate various and multiple chips to realize different integrated circuit packaging functions. In order to embed the chip in the substrate 1, it is necessary to set the center position of the chip A groove 2 is used to place at least one chip. Although this method can save vertical space and reduce the thickness of the package, the edge of the substrate 1 will be bent toward the opening of the groove 2 due to the heat effect in the subsequent packaging process. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/29H01L23/24H01L23/498H01L21/48H01L21/54H01L21/56H01L21/60
CPCH01L23/29H01L23/295H01L23/49827H01L23/24H01L21/56H01L21/54H01L21/486H01L24/81H01L2224/16225H01L2224/18H01L2924/15153H01L2224/73267H01L2224/32225H01L2224/92244H01L2224/16227H01L2924/15311H01L2224/04105H01L2224/12105
Inventor 杨振洲
Owner TIANJIN HENGLIYUANDA INSTR
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