High-yield die casting alloy material suitable for use in mobile phone medium plate and preparation method of high-yield die casting alloy material

Abstract

The present invention relates to a high-yield die casting alloy material suitable for use in a mobile phone medium plate and a preparation method of the high-yield die casting alloy material. The alloy comprises the following components of, 11.0 wt%-15.0 wt% of Si, 1.0 wt%-2.0 wt% of Mg, 0.1%-0.5% of Fe, 0.2 wt%-0.8 wt% of Mn, less than 0.5 wt% of Ce, 0.01 wt%-0.5 wt% of Zr, less than 0.15 wt% ofCu, less than 0.01 wt% of rest of impurities, and the balance of Al. compared to the prior art, the preparation method significantly improves the yield strength and elongation of the material by adding Mn, Si, Mg and Ce to the aluminum alloy and introducing three strengthening phases Mg2Si, MnAl6 and Al11Ce3 binary precipitated phase.

Description

technical field [0001] The invention relates to an aluminum alloy, in particular to a high-yield die-casting alloy material suitable for a middle plate of a mobile phone and a preparation method thereof. Background technique [0002] The mobile phone mid-board refers to the substrate inside the high-end smartphone, which is mainly used to support the internal circuit board of the mobile phone and dissipate the heat generated by the internal chips and lines of the mobile phone in time. Its thickness is generally thin, about 0.5mm. The performance of the middle board of the mobile phone requires the material to have high strength to ensure the strength required for it to support the circuit board; the material is required to have excellent thermal conductivity so that the internal temperature can be transferred to the edge in time and released in time; The material is required to have excellent forming performance, so as to facilitate stamping and small-angle bending, and ensu...

AI Technical Summary

Problems solved by technology

First of all, the structure of the middle plate of the mobile phone is more complicated. The ordinary stamped aluminum strip can no longer meet its design requirements. The die-casting and molding methods can deal with the complex structure inside the mobile phone and can form ultra-thin and high-strength mobile phone structural components. However, the traditional The yield strength can only reach about 160MPa, and the elongation rate is below 2%. Secondly, the strength of the material is also increasing. With the development of the double-sided glass mobile phone market, the yield strength of the middle plate of the mobile phone is required to increase. It has reached an unprecedented height, and the existing die-casting and molding methods are difficult to meet the requirements

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