Wafer bonding equipment and detection method

Abstract

The embodiment of the invention discloses wafer bonding equipment and a detection method. According to the equipment, a first chuck in the equipment is provided with at least three detection elementsand adjusting elements; a plurality of detection elements on the first chuck are used for detecting a distance between the first chuck and the second chuck at the position of each detection element, and the adjusting elements in one-to-one correspondence with the detection elements are used for adjusting the distance between the first chuck and the second chuck, so that the parallelism of the first chuck and the second chuck is adjusted, wherein the at least three detection elements are not located on the same straight line, so that when the distances, detected by the at least three elements,between the first chuck and the second chuck are equal, it can be guaranteed that the upper chuck and the lower chuck in the wafer bonding equipment are parallel to each other. According to the waferbonding equipment provided by the embodiment of the invention, at least three detection elements and at least three adjusting elements can be utilized, so that the upper chuck and the lower chuck in the wafer bonding equipment have good parallelism.

Description

technical field [0001] The present application relates to the technical field of semiconductor integrated circuit manufacturing, in particular to a wafer bonding equipment and a detection method. Background technique [0002] With the continuous development of wafer bonding technology, 3D (that is, Three-dimensional, referred to as 3D) integrated circuits and micromechanical systems using this technology are also continuously improved. Among them, the wafer bonding technology will be fixed in The technology in which the upper wafer (i.e. carrier wafer) on the upper chuck is closely bonded to the lower wafer (i.e. device wafer) fixed on the lower chuck. [0003] like figure 1 and figure 2 As shown, in the process of bonding two wafers, one of the wafers is fixed, and the other wafer is gradually approaching the wafer. When the distance between the two wafers is 50um, the wafer bonding equipment uses a thimble Striker withstands the middle position of the upper wafer 3 fix...

AI Technical Summary

Problems solved by technology

If the relative parallelism of the upper and lower chucks is good at this time, such as figure 1 As shown, the bonding wave spreads to both edges at the same speed, and the alignment accuracy of the two wafers is high, so that the bonding quality of the above two wafers is good; if the relative parallelism of the upper and lower chucks is not good at this time ,like figure 2 As shown, the speed at which the bonding wave spreads to the two edges is inconsistent, so that the alignment accuracy of the two wafers is poor, and the two wafers may even be staggered, resulting in the problem of slippage

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