Chip heat exchanger and variable frequency air conditioner

A technology of heat exchangers and indoor heat exchangers, applied in indirect heat exchangers, air-conditioning systems, instruments, etc., can solve problems such as control logic errors, hardware failures, and burning computer boards, so as to reduce production costs and production Difficulty, the effect of reducing the chip temperature

Pending Publication Date: 2020-07-21
QINGDAO HAIER AIR CONDITIONER GENERAL CORP LTD +1
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, under the high temperature environment in summer, the chip of the computer board of the inverter air conditioner has poor heat dissipation, which leads to slow and difficult frequency increase of cooling, easy error reporting of control logic, insufficient cooling capacity, and high power consumption during operation, causing complaints from users
T3 working condition (53°C) or higher ambient temperature, air temperature around the inverter chip +10°C (63°C), difference between the heat source temperature of the computer board (68-120°C) and the ambient temperature (5-57°C) become smaller, the heat dissipation power becomes smaller, and even the computer board is burned, the system is down, and the hardware failure is caused.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip heat exchanger and variable frequency air conditioner

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The following description and drawings illustrate specific embodiments of the invention sufficiently to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely represent possible variations. Individual components and functions are optional unless explicitly required, and the order of operations may vary. Portions and features of some embodiments may be included in or substituted for those of other embodiments. The scope of embodiments of the present invention includes the full scope of the claims, and all available equivalents of the claims. Herein, various embodiments may be referred to individually or collectively by the term "invention", which is for convenience only and is not intended to automatically limit the scope of this application if in fact more than one invention is disclosed. A single invention or inventive concept. Herein, relational terms such...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a chip heat exchanger and a variable frequency air conditioner, and belongs to the field of chip radiating. The chip heat exchanger comprises a heat tube, a capillary tube, anoutdoor heat exchanger, an indoor heat exchanger and a compressor; an evaporation section of the heat tube is arranged below a chip of an air conditioner computer board; a condensation section of theheat tube is wound with the capillary tube; a first end of the capillary tube is connected with the indoor heat exchanger; a second end of the capillary tube is connected with the outdoor heat exchanger; and the outdoor heat exchanger and the indoor heat exchanger are respectively connected with the compressor. In the scheme, the evaporation section of the heat tube absorbs heat; the condensationsection releases the heat; a refrigerant in the heat tube fully releases heat for condensing by connecting the capillary tube; the temperature of the chip is reduced; and the problem of customer complaints caused by the facts that refrigerating frequency rise is slow and difficult, control logic is prone to error reporting, the refrigerating capacity is insufficient and the operating power consumption is high because of poor chip radiating of the air conditioner computer board in a high-temperature environment in summer.

Description

technical field [0001] The invention relates to the technical field of air conditioning, in particular to a chip heat exchanger and a frequency converter air conditioner. Background technique [0002] At present, under the high temperature environment in summer, the chip of the inverter air conditioner computer board has poor heat dissipation, which leads to slow and difficult cooling frequency increase, error-prone control logic, insufficient cooling capacity, and high power consumption during operation, causing complaints from users. T3 working condition (53°C) or higher ambient temperature, air temperature around the inverter chip +10°C (63°C), difference between the heat source temperature of the computer board (68-120°C) and the ambient temperature (5-57°C) When the temperature becomes smaller, the heat dissipation power becomes smaller, and even computer boards are burned, the system goes down, and hardware failures occur. Contents of the invention [0003] The embo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04F25B41/06F24F1/24G06F1/20F25B41/37
CPCF28D15/04F24F1/24G06F1/20F25B41/37Y02B30/70Y02D10/00
Inventor 董旭王飞罗荣邦王晓春
Owner QINGDAO HAIER AIR CONDITIONER GENERAL CORP LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products