Quantum dot light-emitting diode and its preparation method
A quantum dot light-emitting and diode technology, which is used in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as carrier injection imbalance, increase surface work function, injection balance, and improve hole injection. The effect of efficiency
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[0029] On the other hand, the embodiment of the present invention also provides a method for preparing a quantum dot light-emitting diode, such as figure 2 shown, including the following steps:
[0030] S01: Provide a base;
[0031] S02: Prepare a material layer composed of organic molecules on the substrate; wherein, the organic molecules contain electron withdrawing groups.
[0032]The preparation method of the quantum dot light-emitting diode provided by the embodiment of the present invention is simple in process and low in cost, and the device can be obtained by directly preparing a material layer composed of unique organic molecules on the substrate; the material in the device finally obtained by the preparation method The layer is between the anode and the quantum dot light-emitting layer, and is a material layer made of organic molecules containing electron withdrawing groups. Such organic molecules can increase the surface work function of the anode material and red...
Embodiment 1
[0044] A kind of QLED light-emitting device, its structure diagram is as follows figure 1 As shown, from bottom to top, it includes a substrate, an anode disposed on the substrate, a hole injection layer disposed on the anode, a hole transport layer disposed on the hole injection layer, and a hole transport layer disposed on the hole transport layer A material layer consisting of 4-nitrothiophenol, a quantum dot light-emitting layer arranged on the material layer, an electron transport layer arranged on the quantum dot light-emitting layer, a cathode arranged on the electron transport layer, arranged between the anode and the cathode the encapsulation layer.
[0045] in,
[0046] In this embodiment, the substrate adopts a glass substrate;
[0047] In this embodiment, the anode is ITO with a thickness of 150 nm. To take out ITO, first use a nitrogen gun to clear the large particles of dust on the surface, then use detergent, ultrapure water, and isopropyl alcohol to ultrason...
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