Silicon bar cutting technology

Abstract

The invention discloses a silicon bar cutting technology. The silicon bar cutting technology comprises the following steps that firstly, silicon bar square forming is conducted, and a center silicon block and four edge materials which extend in the same direction with a silicon bar are cut; the four edge materials are cut into a first small silicon block, a second small silicon block and a third small silicon block which extend in the same direction with the silicon bar; the length of the cross sections of the first small silicon block and the third small silicon block is 1 / 2 of the width of the cross section of the center silicon block; the length of the cross section of the second small silicon block is the same with the width of the cross section of the center silicon block; and slicingis conducted on the center silicon block, the first small silicon block, the second small silicon block and the third small silicon block, and the slicing direction is parallel to the silicon bar extending direction. The slicing direction is parallel to the silicon bar extending direction, and therefore the length size of a silicon wafer obtained through slicing cannot be limited by the diameterof the silicon bar, and a rectangular silicon wafer with the large length size is easily prepared; and by means of the silicon bar cutting technology, two kinds of silicon wafers different in width specification can be cut, the silicon bar utilization rate can be increased, and the silicon wafer production cost is reduced.

Description

technical field [0001] The invention relates to a silicon rod cutting process. Background technique [0002] Monocrystalline silicon wafers for solar cells are generally cut from silicon rods. Specifically, silicon rods (ie, round rods) are generally squared first, and silicon blocks (ie, square rods or quasi-square rods) are cut out, and then the silicon blocks are sliced ​​to produce silicon wafers. [0003] The overall shape of the silicon wafer is generally rectangular, but in the existing silicon rod cutting process, the slicing direction is perpendicular to the extending direction of the silicon block, that is, the slicing direction is perpendicular to the extending direction of the silicon rod, so the length and width of the silicon wafer are all affected by the silicon rod. diameter limitation. If a rectangular silicon wafer with a larger length and size is to be prepared, a silicon rod with a larger diameter must be prepared in advance, which increases the difficu...

AI Technical Summary

Problems solved by technology

[0003] The overall shape of the silicon wafer is generally rectangular, but in the existing silicon rod cutting process, the slicing direction is perpendicular to the extending direction of the silicon block, that is, the slicing direction is perpendicular to the extending direction of the silicon rod, so the length and width of the silicon wafer are all affected by the silicon rod. diameter limit

If a rectangular silicon wafer with a larger length and size is to be prepared, a silicon rod with a larger diameter must be prepared in advance, which increases the difficulty and cost of the silicon rod preparation process

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