Three-dimensional stacked structure siw duplexer
A technology of three-dimensional stacking and duplexer, which is applied in the direction of waveguide devices, circuits, electrical components, etc., can solve the problem that cannot meet the application requirements of small array element spacing of active phased array antennas in the millimeter wave band, occupies an area, and does not meet the requirements of watts. Chip active phased array antenna signal vertical transmission requirements and other issues, to achieve the effect of easy high-density integration, easy miniaturization, easy high-density integration
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[0015] refer to figure 1 , figure 2. In the preferred embodiment described below, a three-dimensional stacked structure SIW duplexer includes: a transmitting laminated SIW filter 4 on a multilayer dielectric substrate, a receiving laminated SIW filter 5, a transmitting and output signal plane transmission line 6, Receive input signal plane transmission line 7, send and receive combined signal plane transmission line 8, transmit input signal plane transmission line 9, receive output signal plane transmission line 10, characterized in that: transmit stacked SIW filter 4 and receive stacked SIW filter 5 are composed of The SIW resonant cavity composed of rectangularly arranged metallized through holes 11 arranged in each dielectric layer is composed of vertical stacking; the transmission output signal plane transmission line 6 and the reception input signal plane transmission line 7 are located on the top metal surface of the SIW duplexer. The output and input of the filter 4 ...
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