Three-dimensional stacked structure siw duplexer

A technology of three-dimensional stacking and duplexer, which is applied in the direction of waveguide devices, circuits, electrical components, etc., can solve the problem that cannot meet the application requirements of small array element spacing of active phased array antennas in the millimeter wave band, occupies an area, and does not meet the requirements of watts. Chip active phased array antenna signal vertical transmission requirements and other issues, to achieve the effect of easy high-density integration, easy miniaturization, easy high-density integration

Active Publication Date: 2021-03-05
10TH RES INST OF CETC
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the millimeter wave frequency band, the planar arrangement of multiple resonant cavities will also occupy too much area in the XY direction, which is limited by the 1 / 2 wavelength of the array element spacing, so it cannot meet the requirements of the millimeter wave band active phased array antenna. Application requirements for small array element spacing
In addition, the input and output SIW duplexers in the same plane do not meet the signal vertical transmission requirements of the tile-type active phased array antenna.
Therefore, the SIW reported in a large number of literatures has great limitations in the engineering application of microwave and millimeter wave systems such as active phased array antennas, and needs to be improved on this basis to meet practical applications

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Three-dimensional stacked structure siw duplexer
  • Three-dimensional stacked structure siw duplexer
  • Three-dimensional stacked structure siw duplexer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] refer to figure 1 , figure 2. In the preferred embodiment described below, a three-dimensional stacked structure SIW duplexer includes: a transmitting laminated SIW filter 4 on a multilayer dielectric substrate, a receiving laminated SIW filter 5, a transmitting and output signal plane transmission line 6, Receive input signal plane transmission line 7, send and receive combined signal plane transmission line 8, transmit input signal plane transmission line 9, receive output signal plane transmission line 10, characterized in that: transmit stacked SIW filter 4 and receive stacked SIW filter 5 are composed of The SIW resonant cavity composed of rectangularly arranged metallized through holes 11 arranged in each dielectric layer is composed of vertical stacking; the transmission output signal plane transmission line 6 and the reception input signal plane transmission line 7 are located on the top metal surface of the SIW duplexer. The output and input of the filter 4 ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an SIW duplexer with a three-dimensional stacked structure, and relates to the field of microwave passive devices. The invention aims to provide an SIW duplexer which is easy to miniaturize and high in density integration and can realize vertical transmission of received and transmitted signals. The method is realized through the following technical scheme: a technical modeof combining a laminated SIW filter and a planar transmission line is adopted, the two laminated SIW filters used for transmitting and receiving are formed by vertically stacking SIW resonant cavities arranged on dielectric layers, the transmitting and receiving input and output transmission lines are located on the top metal surface of the SIW duplexer, and the transmitting and receiving input and output transmission lines and the top transmitting and receiving combined signal plane transmission line form a T-shaped structure after being bent. The input ports and the output ports are positioned on different planes of the top layer and the bottom layer; and the multiple sections of planar transmission lines located at the top layer and the bottom layer respectively perform T-shaped combination and horizontal lead-out on the input and output ports of the transceiving filter to form the three-dimensional stacked structure SIW duplexer meeting the actual application requirements of the tile type active phased array antenna under the millimeter wave frequency band.

Description

technical field [0001] The invention relates to the field of microwave passive devices and relates to a SIW (Substrate Integrated Waveguide) SIW duplexer with a three-dimensional stacked structure. Background technique [0002] The SIW duplexer is the main accessory of the different frequency duplex radio station and the repeater station. Its function is to isolate the transmitting and receiving signals, so as to ensure that both receiving and transmitting can work normally at the same time. It is composed of two sets of bandpass filters with different frequencies. Substrate Integrated Waveguide (SIW) technology is one of the emerging and hot technologies in microwave passive direction in recent years. The substrate-integrated waveguide filter is a filter implemented on a dielectric substrate. Its performance is similar to that of a rectangular waveguide filter, but it belongs to a planar circuit. It has the characteristics of high quality factor, large power capacity, eas...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H01P1/20H01P1/208
CPCH01P1/20H01P1/208
Inventor 朱勇陆宇
Owner 10TH RES INST OF CETC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products