A kind of flexible sensor manufacturing process and flexible sensor

Abstract

The invention provides a flexible sensor manufacturing process and a flexible sensor. The manufacturing process includes: manufacturing a first flexible substrate layer on a first silicon wafer, and manufacturing a sensor unit on the first flexible substrate layer; The surface of the silicon wafer is manufactured with a circuit unit by a semiconductor process; the side of the first silicon wafer with the sensor unit and the side of the second silicon wafer with the circuit unit are face-to-face bonded, so that the sensor unit and the second silicon wafer are bonded face-to-face. The circuit unit establishes an electrical connection relationship to become a detection unit; the back of the second silicon wafer is processed to make a thin silicon wafer, and the first silicon wafer is removed to obtain a single-chip flexible sensor with a detection unit. The flexible sensor manufacturing process proposed by the present invention has strong process compatibility and can be produced in batches. The structure of the manufactured flexible sensor is greatly simplified, with high integration and superior performance, and can meet the needs of flexible applications in wearable, medical, robotics and other fields.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a flexible sensor manufacturing process and the flexible sensor. Background technique [0002] With the continuous development of human society towards industrialization, informatization, and intelligence, related fields have put forward higher requirements for sensors in electronic technology, and there is an urgent need for flexible, bendable, and stretchable flexible sensing technologies to meet The needs of wearable electronics, medical, robotics, aerospace and other fields. At present, flexible sensing technology has become a very challenging and potential development direction, and has broad development prospects in different fields. [0003] At present, flexible sensors are still mainly manufactured by printing or transfer (Stamp Transfer), and each of these methods has different disadvantages: [0004] 1) The sensing unit and the circuit unit that provides readout and s...

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Problems solved by technology

[0007] Aiming at the deficiencies in the prior art, the present invention provides a flexible sensor manufacturing process and a flexible sensor, which are used to solve the limitation problem that the traditional flexible sensor is difficult to produce in batches, which leads to its slow development in application, and to solve the problem of traditional flexible sensor The technical shortcomings of a large number of leads and an uncompact structure caused by the connection between the sensor unit and the circuit unit by leads

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