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Polyimide resin and production method therefor, polyimide solution, and polyimide film and production method therefor

A technology of polyimide resin and polyimide film, which is applied in the field of polyimide resin and its manufacture, polyimide solution, and polyimide film and its manufacture, can solve the problem of transparency reduction, The mechanical strength and toughness of the film are reduced, and it is not easy to remove by water. It achieves the effect of small dimensional change, transparency and mechanical strength, and excellent solubility.

Inactive Publication Date: 2020-05-29
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In thermal imidization without using an imidization catalyst or a dehydrating agent, heat treatment at a high temperature is required for imidation, so the film tends to be colored yellow and the transparency tends to decrease
In addition, in thermal imidization, it is not easy to completely remove the water generated by the dehydration of polyamic acid
The imidization catalyst, dehydrating agent, water, etc. remaining in the film may cause defects such as voids, resulting in a decrease in the mechanical strength and toughness of the film

Method used

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  • Polyimide resin and production method therefor, polyimide solution, and polyimide film and production method therefor
  • Polyimide resin and production method therefor, polyimide solution, and polyimide film and production method therefor

Examples

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Embodiment

[0097] Hereinafter, the present invention will be described in more detail based on Examples and Comparative Examples. In addition, this invention is not limited to the following Example.

[0098] [Synthesis of polyamic acid]

[0099] 138 g of N,N- dimethylformamide (DMF) was put into the 500 mL separable flask, and it stirred under nitrogen atmosphere. Diamine and the dianhydride were injected|thrown-in at the ratio shown in Table 1 here, and it stirred and reacted for 5 hours in nitrogen atmosphere, and obtained the polyamic-acid solution of 18% of solid content concentration. The abbreviations of the monomers shown in Table 1 are as follows. Since the polymerization of Comparative Example 7 was not carried out, subsequent studies were not carried out.

[0100] TFMB: 2,2’-bis(trifluoromethyl)benzidine

[0101] 3,3’-DDS: 3,3’-Diaminodiphenylsulfone

[0102] CBDA: 1,2,3,4-cyclobutanetetracarboxylic dianhydride

[0103] BPDA: 3,3’,4,4’-Biphenyltetracarboxylic dianhydride ...

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Abstract

This polyimide includes an alicyclic acid dianhydride, a fluorine-containing aromatic acid dianhydride, and a 3,3',4,4'-biphenyltetracarboxylic acid dianhydride, as acid dianhydrides, and a 3,3'-diaminodiphenyl sulfone and a fluoroalkyl-substituted benzidine, as diamines. This polyimide film includes the abovementioned polyimide resin. The polyimide film can be obtained by applying, on a substrate, a polyimide solution obtained by dissolving the polyimide resin in an organic solvent, and removing the solvent.

Description

technical field [0001] The present invention relates to polyimide resin and its manufacturing method, polyimide solution, polyimide film and its manufacturing method. Background technique [0002] With the rapid progress of electronic devices such as displays, touch panels, and solar cells, thinning, lightening, and further flexibility of the devices are required. In response to these requirements, research is underway to replace glass materials used for substrates, cover windows, and the like with plastic film materials. Especially in applications that require high heat resistance, dimensional stability in high temperature and high humidity environments, and high mechanical strength, polyimide films are being studied as glass substitute materials. [0003] Polyimide is excellent in heat resistance and dimensional stability. On the other hand, general wholly aromatic polyimides are colored yellow or brown and do not show solubility in organic solvents. Introduction of an ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18
CPCC08J5/18C08G73/1042C08G73/1039C08G73/1064C08G73/1078C08J2379/08C08G73/1032
Inventor 近藤康孝
Owner KANEKA CORP
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