Sub-module redundancy configuration method and system of modular multilevel converter
A modular multi-level, redundant configuration technology, applied in the direction of output power conversion devices, electrical components, etc., can solve the problems of underutilization of redundant modules, overvoltage damage of capacitive equipment, etc., to enhance fault ride-through capacity, reducing the harmonic content of the output voltage, the effect of reducing the loss
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Embodiment 1
[0041] An embodiment of the present invention provides a sub-module redundant configuration method for a modular multilevel converter, such as figure 1 shown, including the following steps:
[0042] Step S1: Determine the number of faulty sub-modules in the modular multilevel converter.
[0043] In the embodiment of the present invention, such as figure 2 As shown, a single bridge arm of a modular multilevel converter contains hundreds of power sub-modules, and the structure of the sub-modules can be divided into three types: half H-bridge, full H-bridge and double-clamped sub-modules. , once a sub-module fails, the bypass switch will act to remove the faulty sub-module, and then put the redundant module into operation instead of the faulty module. The system can detect the faulty module through the fault detector. If the sub-module fails, the fault The detector adds 1 to the statistics of faulty sub-modules, and feeds back the statistical results to the system to determine...
Embodiment 2
[0079] An embodiment of the present invention provides a sub-module redundant configuration system of a modular multilevel converter, such as Figure 10 shown, including:
[0080] The module 1 for determining the number of faulty sub-modules is used to determine the number of faulty sub-modules in the modular multilevel converter; this module executes the method described in step S1 in Embodiment 1, which will not be repeated here.
[0081] The calculation module 2 is used to calculate the capacitor reference voltage of the sub-modules of the modular multilevel converter based on the number of faulty sub-modules; this module executes the method described in step S2 in Embodiment 1, which will not be repeated here .
[0082] The obtaining module 3 is used to obtain the target output voltage of the upper bridge arm and the target output voltage of the lower bridge arm of the modular multilevel converter; this module executes the method described in step S3 in Embodiment 1, and ...
Embodiment 3
[0086] An embodiment of the present invention provides an electronic device, such as Figure 11 As shown, it includes: at least one processor 401 , such as a CPU (Central Processing Unit, central processing unit), at least one communication interface 403 , memory 404 , and at least one communication bus 402 . Wherein, the communication bus 402 is used to realize connection and communication between these components. Wherein, the communication interface 403 may include a display screen (Display) and a keyboard (Keyboard), and the optional communication interface 403 may also include a standard wired interface and a wireless interface. The memory 404 may be a high-speed RAM memory (Ramdom Access Memory, volatile random access memory), or a non-volatile memory (non-volatile memory), such as at least one disk memory. Optionally, the memory 404 may also be at least one storage device located away from the aforementioned processor 401 . The processor 401 can execute the submodule ...
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