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5G millimeter wave antenna and manufacturing method thereof

A manufacturing method and millimeter-wave technology, applied to antennas, antenna arrays, devices for manufacturing antenna arrays, etc., can solve problems such as difficult processing costs, complex structural design, reduced efficiency of microstrip patch antennas, and poor processing accuracy and etching accuracy. To achieve the effect of ensuring plasticizing quality and plasticizing ability, reducing surface roughness and high precision

Active Publication Date: 2020-05-19
深圳市聚慧达科技有限公司
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Problems solved by technology

In the millimeter wave frequency band, the traditional PCB process has obvious disadvantages in package integration and miniaturization. The surface wave effect and the loss of the microstrip line at the bend and discontinuity cause the efficiency of the microstrip patch antenna to decrease.
LTCC is a relatively new packaging technology, but the high dielectric constant of the LTCC medium causes the antenna to be greatly affected by surface waves in the millimeter wave and terahertz frequency bands, resulting in problems such as decreased efficiency of the antenna and distortion of the pattern
Diffusion bonding technique (Meta Diffusion BondingTechenique, MDBT) is suitable for complex metal cavity structure, but its processing accuracy is limited by copper foil etching accuracy and poor
The Micro-electromechanical Systems (MEMS) process is to metallize the surface of silicon substrates with different thicknesses of corresponding shapes, and then perform interlayer metal bonding to form complex inner cavity structures. The process is characterized by the ability to achieve micron-scale High-precision metal inner cavity structure, but its processing cost makes it difficult to apply to complex structural design

Method used

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  • 5G millimeter wave antenna and manufacturing method thereof
  • 5G millimeter wave antenna and manufacturing method thereof
  • 5G millimeter wave antenna and manufacturing method thereof

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Embodiment Construction

[0050] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings. However, those skilled in the art know that the present invention is not limited to the drawings and the following embodiments.

[0051] The following is attached Figure 1-4 Explanation of reference signs:

[0052] 1 is feed network + radiation layer; 2 is feed network layer; 3 is mold; 4 is mold insert 1; 5 is mold insert 2; 6 is mold insert 3; 7 is LCP substrate; 8 is UV Coating layer; 9 is a metal plating layer.

[0053] (1) Injection molding

[0054] The plastic particles for injection molding are selected from LCP VECTRA series E130I; the mold is made of mold steel with a hardness not lower than HRC65°, and the rear mold is processed by high-speed CNC with a spindle speed of not lower than 30,000r / min. The corners ...

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Abstract

The invention relates to a manufacturing method of a millimeter wave array antenna. The method comprises the following steps: a plastic base material of an antenna fragmentation model is obtained through an injection molding method; and metallization treatment is carried out on the surface of the plastic base material. According to the millimeter wave array antenna processing method, the manufacturability of the product is improved, and batch production is facilitated; the millimeter wave antenna cost is reduced, the product weight is reduced, and the transportation and installation difficultyand cost are reduced.

Description

technical field [0001] The present invention relates to the field of communications, in particular to a 5G millimeter wave antenna and a manufacturing method thereof. [0002] networks Background technique [0003] The fifth generation mobile communication system (5th generation mobile networks, 5G for short) is getting closer and closer to official commercial use (2020). Every stage of mobile communication system development requires wider spectrum resources, and its spectrum resources are mainly concentrated in frequency bands below 6 GHz. At the same time, the wireless smart devices of the Internet of Things use frequency bands below 6 GHz, which causes spectrum resource shortage. A large number of devices are concentrated in low-frequency spectrum resources, causing serious interference sources in the electromagnetic environment, making it difficult to implement high-speed mobile communication systems. The millimeter wave frequency band has a pure electromagnetic envi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q21/00H01Q1/38H01Q1/50
CPCH01Q21/0087H01Q1/38H01Q1/50H01Q21/00
Inventor 谢咏君黄飞冯彬
Owner 深圳市聚慧达科技有限公司
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