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Adhesive composition, adhesive composition manufacturing method, and packaging structure

A technology of composition and adhesive, which is applied in the direction of non-polymer adhesive additives, adhesives, adhesive additives, etc., and can solve the problems of improving the water and oxygen barrier properties, etc.

Pending Publication Date: 2020-05-19
SHENZHEN CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, under the harsh high temperature and high humidity (85°C, 85RH%) conditions of the current adhesive materials, the water and oxygen barrier properties need to be further improved

Method used

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  • Adhesive composition, adhesive composition manufacturing method, and packaging structure
  • Adhesive composition, adhesive composition manufacturing method, and packaging structure
  • Adhesive composition, adhesive composition manufacturing method, and packaging structure

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Embodiment Construction

[0028] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

[0029] It should be noted that in the description of the present application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred devic...

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PUM

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Abstract

The embodiment of the invention provides an adhesive composition. The adhesive composition comprises a prepolymer, a cross-linking agent, an adhesion promoter, inorganic particles, a nano inorganic matter, a catalyst and a tackifier, wherein the mass percent of the prepolymer is 70%-75%, the mass percent of the cross-linking agent is 5%-8%, the mass percent of the adhesion promoter is 1%-5%, the mass percent of the inorganic particulate matter is 0.5%-1%, the mass percent of the nano inorganic matter is 3%-5%, the mass percent of the catalyst is 3%-5%, and the mass percent of the tackifier is10%-15%. The nano inorganic matter is added into the adhesive composition, wherein the nano inorganic matter is uniformly dispersed in a mixed system of the prepolymer, the cross-linking agent, the adhesion promoter and the tackifier, and then the nano inorganic matter is cured, so that the water vapor permeation path is prolonged, and the water vapor blocking capacity of the adhesive material isimproved. In addition, the selected nano inorganic matter is good in thermal conductivity, and electrostatic damage caused by heat accumulation can be prevented.

Description

technical field [0001] The present application relates to the field of display technology, in particular to an adhesive composition, a manufacturing method of the adhesive composition, and a packaging structure. Background technique [0002] With the development of science and technology, people's demand for liquid crystal display resistance to the environment is gradually increasing, and the high temperature and high humidity environment has the most significant impact on the life of liquid crystal displays. In a liquid crystal display, external signals such as a printed circuit board (PCB) are transmitted to the inside of the panel through exposed metal lines on one side of a thin film transistor (TFT). Usually, after the liquid crystal module is assembled, adhesive glue is used for sealing and reinforcement. However, under the harsh high temperature and high humidity (85°C, 85RH%) conditions of the current adhesive materials, their water and oxygen barrier properties nee...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/04C09J11/06C09J11/04G02F1/1339
CPCC08K2003/2237C08K2003/385C08K2201/011C08L2205/025C09J11/04C09J11/06C09J183/04G02F1/1339C08L83/04C08K5/544C08K5/5415C08K3/22C08K7/00C08K3/38C08K13/04
Inventor 张霞陈孝贤
Owner SHENZHEN CHINA STAR OPTOELECTRONICS TECH CO LTD
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