Magneto-rheological plastomer controllable sticking device and preparation method thereof

Abstract

The invention discloses a magneto-rheological plastomer controllable sticking device and a preparation method thereof. The controllable sticking device comprises a plurality of magneto-rheological plastomer modules and an electromagnet, wherein each magneto-rheological plastomer module comprises a magneto-rheological plastomer inner core and an elastic shell wrapped outside the magneto-rheologicalplastomer inner core; all the magneto-rheological plastomer modules are distributed in an array mode; and the electromagnet comprises a coil and a magnetic conductive skeleton, the coil is arranged in the magnetic conductive skeleton, and all the magneto-rheological plastomer modules are arranged on the magnetic conductive skeleton. The controllable sticking device provided by the invention comprises magneto-rheological plastomers encapsulated in the elastic shells and the electromagnet. The current is controlled to adjust the size of a magnetic field, change the array structural stiffness and surface morphological characters and adjust sticking force. In the preparation process, there is no need to adopt photoetching, micro-nano machining and other complex processes, and the magneto-rheological plastomer controllable sticking device is convenient to manufacture and low in cost and can be applied in a characteristic environment (open environment).

Description

technical field [0001] The invention relates to the technical field of mechanical automation production equipment, in particular to a controllable adhesion device using magnetorheological plastics and a preparation method thereof. Background technique [0002] The control of adhesion is an important form of grasping and releasing, and has important applications in mechanized and automated production, human bionics, robot manufacturing technology and other fields. The existing methods of controlling the adhesion include thermal control, laser control, pressure control and electric field control. The preparation of these structures usually requires processes such as lithography and micro-nano processing. The process requirements are complex, expensive, and usually need to be equipped with complex control modules, which restricts their popularization and application in characteristic environments (aerospace environment). Therefore, It is urgent to design a controllable adhesio...

AI Technical Summary

Problems solved by technology

The preparation of these structures usually requires processes such as lithography and micro-nano processing. The process requirements are complex, expensive, and usually need to be equipped with complex control modules, which restricts their popularization and application in characteristic environments (aerospace environment). Therefore, It is urgent to design a controllable adhesion device with simple structure, simple preparation method and low cost

Images