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A kind of anti-mold and mildew-removing agent for ceiling and preparation method thereof

A mildew remover and ceiling technology, applied in botany equipment and methods, biocides, bactericides, etc., can solve the problems of putty paint falling off, destroying the overall decoration, and decreasing aesthetics, so as to avoid sterilization treatment, improve air, The effect of reducing potency

Active Publication Date: 2021-09-03
THE SECOND AFFILIATED HOSPITAL ARMY MEDICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the ceiling is moldy, the putty paint will partially fall off, and the aesthetics will decrease. The moldy mold on the ceiling will also produce a large number of spores, which will float in the air, making the surrounding air full of musty smell, and the spores will also spread to other walls, making other areas also Mildew, destroying the overall decoration

Method used

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  • A kind of anti-mold and mildew-removing agent for ceiling and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] Embodiment 1: Preparation 1 of mildew and antifungal agent:

[0036] Adhesive granules in this example were weighed according to the following raw materials: 100g N-methylolacrylamide, 100g acrylic acid, 10g calcium chloride, 30g ammonium persulfate, 5g N, N-methylenebisacrylamide, 10g casein Sodium, 5g lactic acid, 2g polyvinyl alcohol.

[0037] The preparation method of the adhesive particle of the present embodiment is as follows:

[0038]Gel precursor preparation: Dissolve N-methylolacrylamide in 700ml of sodium hydroxide solution with a concentration of 2mol / L, mix well, add acrylic acid, 600ml deionized water and stir well, then add polyvinyl alcohol, pass Ammonium sulfate, N, N-methylenebisacrylamide, stir evenly, pass nitrogen into the solution, exhaust for 20 minutes, discharge the air in the solution and seal it, heat it in a water bath to 50°C, and stir for 1 hour to obtain a gel Precursor;

[0039] Gel modification: Add lactic acid, sodium caseinate, and ...

Embodiment 2

[0046] Embodiment 2: Preparation two of mildew and antifungal agent:

[0047] Adhesive granules in this example are weighed according to the following raw materials: 200g N-methylolacrylamide, 180g acrylic acid, 20g calcium chloride, 60g ammonium persulfate, 10g N, N-methylenebisacrylamide, 12g casein Sodium, 10g lactic acid, 3g polyvinyl alcohol.

[0048] The preparation method of the adhesive particle of the present embodiment is as follows:

[0049] Gel precursor preparation: Dissolve N-methylolacrylamide in 1200ml of sodium hydroxide solution with a concentration of 2mol / L, mix well, add acrylic acid, 700ml deionized water and stir well, then add polyvinyl alcohol, pass Ammonium sulfate, N, N-methylenebisacrylamide, stir evenly, pass nitrogen into the solution, exhaust for 20 minutes, discharge the air in the solution and seal it, heat it in a water bath to 50°C, and stir for 1 hour to obtain a gel Precursor;

[0050] Gel modification: Add lactic acid, sodium caseinate,...

Embodiment 3

[0057] Embodiment 3: Preparation three of mildew and antifungal agent:

[0058] Adhesive granules in this example were weighed according to the following raw materials: 150g N-methylolacrylamide, 150g acrylic acid, 15g calcium chloride, 40g ammonium persulfate, 6g N, N-methylenebisacrylamide, 11g casein Sodium, 8g lactic acid, 2g polyvinyl alcohol.

[0059] The preparation method of the adhesive particle of the present embodiment is as follows:

[0060] Gel precursor preparation: Dissolve N-methylolacrylamide in 900ml of sodium hydroxide solution with a concentration of 2mol / L, mix well, add acrylic acid, 500ml deionized water and stir well, then add polyvinyl alcohol, pass Ammonium sulfate, N, N-methylenebisacrylamide, stir evenly, pass nitrogen into the solution, exhaust for 20 minutes, discharge the air in the solution and seal it, heat it in a water bath to 50°C, and stir for 1 hour to obtain a gel Precursor;

[0061] Gel modification: Add lactic acid, sodium caseinate,...

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Abstract

The invention discloses an anti-mildew and mildew-removing agent for ceiling and a preparation method thereof, belonging to the technical field of anti-mildew and mildew-removing agent, comprising the following raw materials: imazalil, hydroxyethyl ethylene diamine, hydroxyethyl starch, coconut oil, mica Powder, adhesive particles, the adhesive particles are gel particles with a particle size of 0.01-0.05mm, the mildew-proof and mildew-removing agent is a suspension, the pH of the suspension is 9-11, the water content is 70-75%, and the mildew-proof The preparation method of the mildew remover includes the steps of preparing a medicinal solution and a mildew and mildew removing agent, wherein the step of the anti-mildew and mildew removing agent is to disperse the obtained medicinal solution, add adhesive particles, and stir under ultraviolet light to obtain the anti-mildew and mildew remover. Mildew agent. The prepared anti-mildew and mildew-removing agent is sprayed on the surface of the ceiling, and the internal bactericidal substances can kill the mold. After the anti-mildew and mildew-removing agent is air-dried, a film is formed, which can also prevent the further spread of the mold. Adhesive particles adhere to the surface of the ceiling, prolong the sterilization effect, and prevent the ceiling from growing mold and mildew in the humid season.

Description

technical field [0001] The invention relates to the technical field of anti-mildew and mildew-removing agents, in particular to a ceiling anti-mold and mildew-removing agent and a preparation method thereof. Background technique [0002] Ceiling mold is a common phenomenon in the humid areas of the south. The reason is that the commonly used building materials themselves have capillary pores. Groundwater will penetrate upwards along the capillary pores of the wall, and moisture will slowly precipitate from the wall surface. Cause mildew, the moisture under the slab will penetrate into the capillary pores inside the floor, and the moisture will slowly precipitate from the surface of the floor, which will also cause mold and stains on the ceiling. In addition, damp floor tiles are also one of the factors that cause mold on the ceiling. During the rainy season, the air is humid and has high water vapor content and high temperature, which makes there be a cold bridge between the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A01N25/04A01N25/24A01N43/50A01N33/08C08F220/06C08F220/58C08F222/38A01P3/00
CPCA01N25/04A01N25/24A01N33/08A01N43/50C08F220/06C08F220/58C08F222/385
Inventor 陈小丽余晓波张曦冯一梅杜欣孙恒蕊王丽冯雪
Owner THE SECOND AFFILIATED HOSPITAL ARMY MEDICAL UNIV
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