On-board stack and its standardized modules

Abstract

The invention discloses an on-board stack body and its standardized module. The standardized module includes: a frame, a circuit board, a heat conduction area, an external connector, a bus connector and a heat dissipation mechanism. The inner wall of the frame is provided with an inner flange suitable for the frame structure, the circuit board is installed on the inner flange, and a serial screw hole is reserved on the inner flange. The external connector and the bus connector are respectively connected to the circuit board, and the frame is provided with a reserved hole for passing through the external connector and the bus connector. The heat conduction area is surrounded by the circuit board. After the circuit board is installed on the inner flange, the heat conduction area is in contact with the frame, and the heat dissipation mechanism is respectively in contact with the high heat components on the circuit board and the frame. The space-borne stacking body and its standardized modules of the invention can physically isolate circuit boards and improve electromagnetic compatibility and space radiation resistance. The heat dissipation effect is better, and the work efficiency is improved. The weight and length of the stack can be flexibly configured to meet the needs of different scenarios.

Description

technical field [0001] The invention relates to the field of small satellite integrated electronic technology, in particular to a spaceborne stack body and a standardized module thereof. Background technique [0002] Small satellites have the characteristics of low cost, short development cycle, and flexible application, and have attracted more and more attention. Each sub-system of a conventional large satellite, such as control sub-system, power supply sub-system, thermal control sub-system, measurement and control sub-system, etc., is installed inside the satellite with an independent chassis, and the power supply and communication between sub-systems are carried out through cables. Compared with large satellites, the mass and volume of small satellites are strictly limited. Therefore, in order to increase the functional density of the entire satellite, each subsystem of the small satellite no longer uses an independently designed chassis, but turns multiple physically s...

AI Technical Summary

Problems solved by technology

[0004] The inventors have found that the prior art has at least the following problems: the above-mentioned stack structure mainly dissipates heat through the heat dissipation strips, the heat dissipation area is small, and the effect is poor, thereby limiting the power of the circuit board

And there is no physical isolation between the circuit boards, and the electromagnetic compatibility and space radiation resistance are poor

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