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High-temperature-resistant photosensitive label and processing method thereof

A processing method and high-temperature-resistant technology, applied in stamps, instruments, identification devices, etc., can solve the problems of poor high-temperature resistance, easy peeling off of the adhesive layer, easy fading, etc., and achieve the effect of good high temperature resistance and not easy to fall off.

Active Publication Date: 2020-05-05
苏州三帆包装材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Labels are mostly used for product packaging and annotation labels for various equipment. For some annotations that require obvious attention, photosensitive labels are often required. This photosensitive label can emit light in a dark environment, but the high temperature resistance of photosensitive labels in the existing market is relatively low. Poor. On the one hand, the adhesive layer is easy to fall off under high temperature environment. On the other hand, the photosensitive powder needs to be added with photosensitive acid compound, which is easy to fade under high temperature. Therefore, to realize the functions of high temperature resistance and light sensitivity at the same time, the above two problems must be solved.

Method used

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Embodiment Construction

[0021] The technical solutions in the embodiments of the present invention are clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, those skilled in the art All other embodiments obtained by personnel without creative work belong to the protection scope of the present invention.

[0022] The invention provides a high temperature resistant photosensitive label, comprising: a base layer, a photosensitive powder coated on the base layer, an adhesive layer arranged under the base layer, and a resin layer arranged on the photosensitive powder layer, the photosensitive powder includes photosensitive pigment and inorganic powder.

[0023] The invention provides a processing method for a high temperature resistant photosensitive label, comprising:

[0024] The first step: base layer treatment, the base layer is made of or...

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Abstract

The invention relates to a high-temperature-resistant photosensitive label and a processing method thereof, a resin layer is designed, the problem that photosensitive powder fades due to the existenceof acidified substances is avoided, and compared with a traditional rubber adhesive, an epoxy resin adhesive is added, so that the high-temperature-resistant photosensitive label is better in high temperature resistance, thicker in colloid and not prone to falling off.

Description

technical field [0001] The invention relates to the field of label processing, in particular to a high temperature resistant photosensitive label and a processing method thereof. Background technique [0002] Labels are mostly used for product packaging and annotation labels for various equipment. For some annotations that require obvious attention, photosensitive labels are often required. This photosensitive label can emit light in a dark environment, but the high temperature resistance of photosensitive labels in the existing market is relatively low. Poor. On the one hand, the adhesive layer is easy to fall off under high temperature environment. On the other hand, the photosensitive powder needs to be added with photosensitive acid compound, which is easy to fade under high temperature. Therefore, the above two problems must be solved in order to realize the functions of high temperature resistance and light sensitivity at the same time. Contents of the invention [0...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F3/02
CPCG09F3/02
Inventor 潘维伟
Owner 苏州三帆包装材料有限公司
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