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Circuit board and cover film laminating process

A cover film and circuit board technology, which is applied in the direction of printed circuit, printed circuit manufacturing, and secondary treatment of printed circuit, etc., can solve the problems of low bonding quality of cover film, low tear resistance of cover film, and easy wrinkle, etc. Achieve the effect of optimizing surface flatness, improving bonding quality and reducing deformation

Active Publication Date: 2020-04-24
SHENZHEN XINYU TENGYUE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the tear resistance of the traditional cover film is relatively low, and wrinkles are prone to appear during the bonding process, especially during the pressing process, resulting in low bonding quality of the cover film

Method used

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  • Circuit board and cover film laminating process
  • Circuit board and cover film laminating process

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Embodiment Construction

[0027] The conception and technical effects of the present invention will be clearly and completely described below in conjunction with the embodiments, so as to fully understand the purpose, features and effects of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, other embodiments obtained by those skilled in the art without creative efforts belong to The protection scope of the present invention.

[0028] In the description of the embodiments of the present invention, if it involves orientation description, for example, the orientation or positional relationship indicated by "upper", "lower", "front", "back", "left", "right" etc. is based on the drawings The orientations or positional relationships shown are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply t...

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PUM

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Abstract

The invention discloses a circuit board and cover film laminating process. The circuit board and cover film laminating process comprises the steps of arranging a cover film with a carrier film attached to the surface, attaching the cover film to a circuit board, pressing a covering area of the cover film, curing the covering area of the cover film, post-processing the circuit board and tearing offthe carrier film. According to the circuit board and cover film laminating process, by attaching the carrier film to the cover film, the thickness of the cover film is increased, the tearing strengthof the cover film is optimized, and the deformation amplitude of the cover film is reduced when the cover film and the circuit board are laminated, so that the laminating quality of the cover film onthe circuit board is improved, and the surface flatness of the circuit board is optimized.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a circuit board covering film bonding process. Background technique [0002] With the rapid development of the electronics industry, the design of circuit boards tends to be more and more high-precision and high-precision. The FPC flexible board has the characteristics of light weight, bending and deflection, and easy three-dimensional assembly, which breaks through the traditional interconnection. Technology, mainly used in the connection parts of electronic products, such as mobile phone cables, LCD modules, etc. [0003] The non-pad area on the circuit board needs to be provided with a solder resist layer to protect the circuit. Traditional flexible circuit boards generally use a press-fit cover film as the solder resist layer to protect the circuit, and the cover film is set to prevent the oxidation of the copper foil on the surface of the circuit board. . ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/28
CPCH05K3/281
Inventor 杨俊陈海坤李星明刘扬杨仕德胥海兵史继红吕剑潘辉朱远芳
Owner SHENZHEN XINYU TENGYUE ELECTRONICS
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