Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Case of electronic device and manufacturing method therefor

A technology for electronic devices and manufacturing methods, applied in chemical instruments and methods, casings, telephone communications, etc., can solve the problems of low surface flatness of the casing, low production efficiency, difficult to roll evenly, etc., and achieve high appearance quality. , The effect of improving surface flatness and improving production efficiency

Inactive Publication Date: 2008-10-01
SHENZHEN FUTAIHONG PRECISION IND CO LTD
View PDF0 Cites 21 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Using this method to make a shell with electronic ink, the production efficiency is not high, and the method of rolling it with a rolling roller to make it bonded firmly is difficult to ensure uniform rolling, which will cause the surface of the shell to be even. Not high, affecting the appearance quality of the shell

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Case of electronic device and manufacturing method therefor
  • Case of electronic device and manufacturing method therefor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] see figure 1 , shows an electronic device housing 10 according to a preferred embodiment of the present invention, the electronic device housing 10 includes a decorative layer 12 and a plastic layer 14, the electronic device housing 10 is integrated by the decorative layer 12 and the plastic layer 14 Formed.

[0020] The decoration layer 12 is disposed on the outer surface of the housing 10 of the electronic device, and characters or graphics are formed thereon. The decorative layer 12 includes a thin film layer 122 and an electronic ink layer 124, the thin film layer 122 is a transparent film, such as the transparent plastic film used in the molding technology of IN MOLDING LAMINATION (IML), it can also be made of glass , fibers, alloys, polymer materials, etc.; the electronic ink layer 124 is a coating containing ink particles, which form characters or graphics through the arrangement of ink particles. The ink particles are charged, which can be controlled by an ele...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
Login to View More

Abstract

The invention provides an electronic device housing body and a production method thereof. The electronic device housing body comprises a decorative layer and a plastic layer, wherein, the decorative layer comprises a film layer and an electronic ink layer which is coated on the film layer. The electronic device housing body is integrated by the decorative layer and the plastic layer as a whole, and the production process thereof is that: the decorative layer is firstly provided and arranged in a mould into which plastic is then poured, and then the plastic and the decorative layer are integrated as a whole to form the electronic device housing body. The electronic device housing body provided by the invention adopts the method that the plastic housing body is integrated as a whole by in-mold lamination to improve the production efficiency; meanwhile, a method that an adhesive is used for bonding can be avoided to ensure that the layers are bonded more fixedly and higher flatness of the surface of the electronic device housing body can be obtained, thus improving the appearance quality and the yield rate of the product.

Description

technical field [0001] The invention relates to an electronic device casing and a manufacturing method of the electronic device casing. Background technique [0002] With the development of mobile communication technology, various electronic devices such as mobile phones are emerging, so that consumers can fully enjoy the convenience brought by mobile technology anytime and anywhere, thus portable electronic devices are becoming more and more popular among consumers. favored by. [0003] The casing is one of the main components of an electronic device, and it is widely used in electronic devices such as telephones, computers, and game machines. At present, the casings of electronic devices are generally plastic casings, alloy casings, etc., and the casings are often accompanied by text or graphics. These characters or graphics are usually printed with ink, and the brightness, clarity and durability of the characters or graphics are not ideal. Now, a new casing appears on ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/06B32B1/02B29C45/16B29C45/26G12B9/02H04M1/02B32B1/00
CPCB29C45/14311B29L2031/445H04M1/0266B29L2031/3431B29C45/14336
Inventor 许哲源肯尼·汉森
Owner SHENZHEN FUTAIHONG PRECISION IND CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products