Packaging structure, manufacturing method thereof and electronic device

A technology of packaging structure and manufacturing method, which is applied in the direction of circuits, electrical components, and electric solid devices, can solve problems such as poor reliability of packaging structures, damage to plating and exposed metal layers, and large laser energy, so as to improve reliability and improve resistance. Effect of Laser Damage Capability

Inactive Publication Date: 2020-04-10
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the process of using laser to groove or open the mold cover, due to the high energy of the laser, it is easy to cause damage to the coating layer and the exposed metal layer on the surface of the substrate, resulting in poor reliability of the packaging structure.

Method used

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  • Packaging structure, manufacturing method thereof and electronic device
  • Packaging structure, manufacturing method thereof and electronic device
  • Packaging structure, manufacturing method thereof and electronic device

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Embodiment Construction

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0035] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0036] In addition, in t...

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Abstract

The invention discloses a packaging structure, a manufacturing method thereof and an electronic device. The manufacturing method of the packaging structure comprises the following steps of providing acircuit substrate with an exposed metal layer; coating a protective layer on the surface of the exposed metal layer; mounting an active device or a passive device on the surface, provided with the exposed metal layer, of the circuit substrate in a surface-mounted manner, and packaging a die sleeve, wherein the active device or the passive device is completely covered by the die sleeve, the tapping operation is conducted on the surface, back on to the circuit substrate, of the die sleeve through laser, an electromagnetic shielding channel is obtained, and the electromagnetic shielding channelpenetrates through the die sleeve and corresponds to the protective layer; and filling the electromagnetic shielding channel with silver paste, and curing the silver paste to obtain a packaging structure. According to the technical scheme, the reliability of the packaging structure can be improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a packaging structure, a manufacturing method thereof, and electronic equipment. Background technique [0002] In the related art, the substrate of the packaging structure usually deposits a coating layer on the surface of the substrate by means of electroplating gold or chemical gold plating, and the coating layer is generally relatively thin. With the gradual application of electromagnetic interference shielding technology, when making the packaging structure, firstly assemble active devices or passive devices on the surface of the substrate, and then package them through the mold sleeve, and use laser to make grooves or grooves on the surface of the mold sleeve. Holes are opened to form an electromagnetic shielding channel, where the electromagnetic shielding channel corresponds to the exposed metal layer on the substrate surface, and then silver paste is fille...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L23/552
CPCH01L21/4846H01L23/552H01L2924/3025H01L2924/19105
Inventor 陶源王德信方华斌
Owner QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD
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