Ultra-broadband uncooled infrared detector with single-layer structure and its preparation method

An uncooled infrared, single-layer structure technology, applied in electric radiation detectors, radiation pyrometry, instruments, etc., can solve the problems of complex manufacturing process and narrow response spectrum of wide-band response devices

Active Publication Date: 2020-10-27
CHINA ACADEMY OF SPACE TECHNOLOGY
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the problems existing in related technologies at least to a certain extent, this application provides a single-layer structure ultra-wideband uncooled infrared detector and its preparation method, which solves the problem of narrow and wide-band response of the traditional single-layer structure. Complex technical issues in device manufacturing process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ultra-broadband uncooled infrared detector with single-layer structure and its preparation method
  • Ultra-broadband uncooled infrared detector with single-layer structure and its preparation method
  • Ultra-broadband uncooled infrared detector with single-layer structure and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present application as recited in the appended claims.

[0050] Such as figure 1 As shown, the first aspect of the present embodiment provides a single-layer ultra-broadband uncooled infrared detector, including an underlying substrate 1 and a double-supported cantilever beam structure located on the underlying substrate 1, wherein

[0051] It also includes a first metal electrode layer 2, a first metal reflective layer 3 and a first metal pr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention relates to an ultra-wide band uncooled infrared detector with a single-layer structure and a preparation method thereof. The ultra-wide band uncooled infrared detector comprises a bottomsubstrate and a double-support cantilever beam structure, and the bottom substrate is provided with a first metal electrode layer, a first metal reflection layer and a first metal protection layer; the double-support cantilever beam structure comprises a second metal layer, a first dielectric layer, a second metal electrode layer, a photosensitive layer and a second dielectric layer; the first dielectric layer is a support layer of the double-support cantilever beam structure; the second metal electrode layer is arranged in the accommodating space in a covering manner, is electrically connected with the first metal electrode layer through a through hole in the first dielectric layer, and is thermally isolated from the substrate through the supporting layer while good electric connection is kept; and the second metal layer is arranged below the first dielectric layer. According to the method, the thin metal layer is additionally arranged on the lower surface of the double-support cantilever beam structure, so that the response waveband of the device is greatly expanded, the absorption efficiency is high, the structure and the process are simple, and the manufacturing cost is low.

Description

technical field [0001] The invention belongs to the technical field of uncooled infrared detectors, and in particular relates to a single-layer structure ultra-wideband uncooled infrared detector and a preparation method thereof. Background technique [0002] The discovery and use of infrared detection technology has greatly expanded the scope of human vision, and it has broad application prospects in information acquisition and material analysis. However, due to the limitations of technology and materials, most of the infrared detectors currently used To achieve wide-band infrared detection requires the use of multiple infrared detectors with different spectral bands, which greatly increases the complexity and cost of the system. Therefore, the research and development of infrared detectors with broadband response has important application value. [0003] Theoretically, the uncooled infrared detector has wide-band infrared response characteristics, but it cannot achieve hi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G01J5/20
CPCG01J5/20G01J2005/204
Inventor 刘军库
Owner CHINA ACADEMY OF SPACE TECHNOLOGY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products