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UV curing non-modified organic silicon material for LED packaging and preparation method thereof

A LED packaging, non-modified technology, used in electrical components, circuits, semiconductor devices, etc., can solve the problems of slow curing speed, poor compatibility and low transparency of copolymerized silica gel, and achieve high temperature resistance and ultraviolet light aging resistance. , Improve production efficiency, improve the effect of bonding performance

Inactive Publication Date: 2020-04-03
深圳市晨日科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the poor compatibility between acrylic and silicone materials, the co-polymerized silica gel has slow curing speed, low transparency and poor aging resistance

Method used

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  • UV curing non-modified organic silicon material for LED packaging and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Example 1, UV curing non-modified silicone material for LED packaging

[0029] Prepared from components comprising the following parts by weight:

[0030] 37.5 parts of methyl vinyl silicone oil with viscosity of 1000mPa s and 0.3% vinyl mass fraction; 18.496 parts of methyl vinyl silicone oil with viscosity of 10000mPa s and 0.12% vinyl mass fraction; vinyl mass fraction of 2.1 37.5 parts of methyl vinyl MQ silicone resin;

[0031] 5.5 parts of methyl hydrogen-containing silicone oil with a viscosity of 100mPa·s and a hydrogen atomic mass fraction of 1.2%;

[0032] 0.002 parts of platinum acetylacetonate; 0.002 parts of ethynyl cyclohexanol; 1 part of hydrolyzed copolymer of silane and dimethyldiethoxysilane.

[0033] The preparation method of the above-mentioned LED encapsulation UV curing non-modified organic silicon material comprises the following steps

[0034] S1) Preparation of component A: Add 24.999 parts of methyl vinyl silicone oil with a viscosity of 1...

Embodiment 2

[0037] Example 2, UV curing non-modified silicone material for LED packaging

[0038] Prepared from components comprising the following parts by weight:

[0039] 88.994 parts of methyl vinyl silicone oil with viscosity of 5000mPa·s and vinyl mass fraction of 0.16%; 5 parts of methyl vinyl silicone oil with viscosity of 1000mPa·s and vinyl mass fraction of 2.3%; viscosity of 70mPa·s, 5 parts of methyl hydrogen-containing silicone oil with a hydrogen atomic mass fraction of 0.77%; 0.004 parts of platinum trifluoroacetylacetonate; 0.002 parts of maleate; γ-(2,3-epoxypropoxy)propyltrimethoxysilane 1 share.

[0040] The preparation method of the above-mentioned LED encapsulation UV curing non-modified organic silicon material comprises the following steps

[0041] S1) Preparation of component A: Add 49.996 parts of methyl vinyl silicone oil with a viscosity of 5000 mPa·s and 0.004 parts of platinum trifluoroacetylacetonate into a reaction vessel and mix evenly at 25°C to obtain c...

Embodiment 3

[0044] Example 3, UV curing non-modified silicone material for LED packaging

[0045] Viscosity is 6000mPa·s, vinyl mass fraction is 19.498 parts of methylphenyl vinyl MDT silicone resin of 5%; Vinyl mass fraction is 5.5% of methyl phenyl vinyl MT silicone resin 41.65 parts; Viscosity is 100mPa· s, 37.6487 parts of phenyl hydrogen-containing silicone oils with a hydrogen atomic mass fraction of 0.32%; 0.003 parts of platinum hexafluoroacetylacetonate; 0.0003 parts of methyl butynol; methacryloxypropyltrimethoxysilane, γ-(2 , 1.2 parts of hydrolyzed copolymer of 3-glycidoxy)propyltrimethoxysilane, phenyltrimethoxysilane, diphenyldimethoxysilane and vinyltrimethoxysilane.

[0046] The preparation method of the above-mentioned UV curing non-modified organic silicon material for LED packaging comprises the following steps:

[0047] S1) Preparation of component A: Add methylphenylvinyl MDT silicone resin and ethyl acetoacetate ketone platinum into a reaction vessel and mix evenl...

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Abstract

The invention belongs to the technical field of LED packaging and particularly relates to a UV curing non-modified organic silicon material for LED packaging and a preparation method thereof. The UV curing non-modified organic silicon material for LED packaging is prepared from the following components in parts by weight: 70 to 95 parts of vinyl polysiloxane, 1 to 10 parts of hydrogen-containing polysiloxane, 0.001 to 0.1 part of a catalyst, 0.0001 to 0.1 part of an inhibitor and 0.1 to 4 parts of an auxiliary agent. According to the organic silicon material disclosed by the invention, the hydrosilylation reaction is catalyzed by s platinum catalyst with a special structure under the irradiation of UV light, so that UV curing is realized on the premise of not carrying out organic group modification, and the organic silicon material is high in curing speed, high in light transmittance and good in aging resistance.

Description

technical field [0001] The invention belongs to the technical field of LED packaging, and in particular relates to a UV-curable non-modified organic silicon material for LED packaging and a preparation method thereof. Background technique [0002] Light-emitting diodes (LEDs), as the fourth-generation lighting source, use semiconductor PN junctions as light sources. The principle of light-emitting is to apply current to compound semiconductors, and when electrons and holes combine to radiate visible light. In order to prevent the LED chip from being affected by factors such as air humidity, harmful gas or mechanical vibration, people use packaging technology to seal the chip and electrodes in the packaging material. [0003] At present, LED packaging materials at home and abroad are mainly divided into epoxy resin and silicone materials, among which silicone materials have both organic and inorganic properties due to their special silicon-oxygen-silicon main chain and organi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K5/00C08K5/05C08K5/11C08K5/5435C08K5/549H01L33/56
CPCC08L83/04C08L2201/08C08L2201/10C08L2205/025C08L2205/035H01L33/56C08K5/0091C08K5/05C08K5/11C08K5/5435C08K5/549
Inventor 郑铮钱雪行
Owner 深圳市晨日科技股份有限公司
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