A kind of grid array device flatness detection tool and detection method

A technology for flatness detection and tooling inspection, which is applied in the direction of mechanical roughness/irregularity measurement, etc., can solve the problems of difficult operation, easy-to-damage device leads, and insufficient detection, so as to achieve effective measurement, ensure flatness, The effect of avoiding damage

Active Publication Date: 2021-04-13
XIAN INSTITUE OF SPACE RADIO TECH
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  • Abstract
  • Description
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Problems solved by technology

Place the grid array device on a marble platform and use a feeler gauge for detection. This method is difficult to operate, easy to damage the lead legs of the device, and the detection is not in place.

Method used

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  • A kind of grid array device flatness detection tool and detection method
  • A kind of grid array device flatness detection tool and detection method

Examples

Experimental program
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Effect test

Embodiment

[0024] like figure 1 and figure 2 As shown, a flatness detection tool for grid array devices, the tool includes a reference tool, a measurement tool A, a measurement tool B and a lead screw; the lead screw can drive the measurement tool A to move up and down;

[0025] The benchmark tooling is a hollow cylinder with a flat plate on the top; there are several through holes on the top plate of the benchmark tooling, and the number of through holes on the top plate of the benchmark tooling is the same as the number of soldering posts on the columnar grid array CG717 device. The diameter of the through hole on the top plate of the tooling is larger than the diameter of the welding post on the columnar grid array CG717 device, preferably 0.9mm, and the distance between the through holes on the top plate of the reference tooling is consistent with the spacing between the welding posts on the columnar grid array CG717 device. The material of the benchmark tooling is stainless steel;...

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Abstract

The invention relates to a grid array device flatness detection tool and a detection method, and belongs to the technical field of grid array device flatness detection. The method of the present invention determines the reference measurement size by sorting out the height of the welding terminal of the device, determines the measurement size according to the measurement requirements for flatness, and uses the superposition method to measure through the tooling. The measurement method is simple and easy to operate and effective in measurement In place, it can avoid damage to the lead legs of the device, and solve the problem of poor soldering caused by poor flatness of the soldered terminals of the device.

Description

technical field [0001] The invention relates to a grid array device flatness detection tool and a detection method, and belongs to the technical field of grid array device flatness detection. Background technique [0002] Grid array devices include two types of packaging, column grid array and ball grid array, and are widely used in electronic products because they are suitable for larger sizes and more I / O (number of pins at input and output terminals). manufacturing field. At the same time, the number of I / Os is large and the density is high. It is necessary to measure the flatness of the pins of the grid array device. The detection requirement is that when the flatness of each pin of the device is ≤0.1mm, good welding quality can be formed, otherwise welding will occur. Not on the quality issues. Soldering quality problems caused by poor flatness are often unavoidable. The quality of solder joints after soldering is inspected by X-ray and CT. It often occurs that there ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B5/28
CPCG01B5/28
Inventor 刘忠丽姜莉琴梁亚萍田雍容李炳东赵静曹征李强杨怡欣刘旺郭瑞霞
Owner XIAN INSTITUE OF SPACE RADIO TECH
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