Composition used for electrolytic deposition copper and acid copper electroplating solution

A technology of electrolytic deposition and composition, applied in the field of electroplating deposition, can solve problems such as copper layer thickness, voids, blind hole filling depressions, etc., and achieve good leveling performance

Active Publication Date: 2020-03-31
JIANGSU AISEN SEMICON MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The current technology has the defect that the copper layer deposited on the surface is thicker, and blind holes are filled with depressions or voids.

Method used

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  • Composition used for electrolytic deposition copper and acid copper electroplating solution
  • Composition used for electrolytic deposition copper and acid copper electroplating solution
  • Composition used for electrolytic deposition copper and acid copper electroplating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Weigh 10.4g of diethylenetriamine and 7.2g of thiourea into a three-necked flask, heat the water bath to 100°C, react for 3 hours, and cool to room temperature to obtain a yellow liquid, add 50ml of acetonitrile as a solvent, and dropwise add 2.5g of allyl The base chloride was heated to reflux for 12 hours, and the solvent and excess allyl chloride were removed under reduced pressure to obtain a modified composition.

Embodiment 2

[0044] Weigh 8g of hexamethylene diamine and 7.2g of thiourea into a three-necked flask, heat the water bath to 100°C, react for 3 hours, and cool to room temperature to obtain a yellow liquid. Add 50ml of acetonitrile as a solvent, and dropwise add 2.1g of benzyl chloride. Base chloride) was heated to reflux for 12 hours, the solvent was removed under reduced pressure and washed, thereby obtaining a modified composition.

Embodiment 3

[0046] The electroplating solution was prepared according to the proportioning ingredients in Table 1, wherein the modified composition was obtained according to Example 1.

[0047] Table 1 Example 3 Electroplating solution composition ratio table

[0048]

[0049] In order to verify the effectiveness of the modified composition provided by this solution in the acid copper electroplating solution, a comparative example 1-2 and this example 3 were prepared below for comparative analysis.

[0050] Wherein, the electroplating solution of Comparative Example 1 was prepared according to the composition ratio in Table 2, and the electroplating solution of Comparative Example 2 was prepared according to the composition ratio in Table 3.

[0051] Table 2 Comparative example 1 Electroplating solution composition ratio table

[0052] Bath composition CuSO4·5H2O H2SO4 CL- SPS PEG 6000 concentration 200g / L 50g / L 50mg / L 1mg / L 1g / L

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PUM

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Abstract

The invention discloses a composition used for electrolytic deposition copper and an acid copper electroplating solution. The composition is characterized by mixing a polyamine compound and thiourea chemicals; carrying out a deamination polymerization reaction under a set temperature condition; and then adding an alkylation or protonation modifier for chemical modification to obtain modified composition, wherein a molar ratio of a polyamine compound to the thiourea chemicals is 1: 10-10: 1, and a molar use amount of the alkylation or protonation modifier is 0.01-10 times that of the polyaminecompound. The invention relates to an acidic copper electroplating additive with good leveling performance. An acid copper electroplating solution can deposit a flat copper layer and can be filled into micro blind holes without forming defects.

Description

【Technical Field】 [0001] The invention belongs to the technical field of electroplating deposition, and particularly relates to a composition for electrolytic deposition of copper and an acid copper electroplating solution. 【Background technique】 [0002] With the development of light weight and miniaturization of electronic equipment such as mobile phones and smart wearables, printed circuit boards, semiconductor substrates and IC substrates usually have the design of micro blind holes, and each is realized by electroplating copper deposition of micro blind holes. The connections between the layers are turned on. [0003] Generally, there are organic additives in the copper electroplating solution. The types of organic additives can make the surface of the electrodeposited copper have better leveling and gloss, and can also change the deposition rate of the electrolytic copper in the micro blind holes. The addition of organic additives The copper deposition of blind micro vias ca...

Claims

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Application Information

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IPC IPC(8): C25D3/38
CPCC25D3/38
Inventor 周家珠刘安张兵向文胜赵建龙朱坤陆兰
Owner JIANGSU AISEN SEMICON MATERIAL CO LTD
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