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Gas spray device and chemical vapor deposition method

A spray device, gas technology, applied in gaseous chemical plating, metal material coating process, coating and other directions, can solve the problem of large difference between the film thickness in the middle and the edge, to improve mixing uniformity, improve film formation uniformity sexual effect

Active Publication Date: 2020-03-27
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The current chemical vapor deposition machine is equipped with a gas windshield at the front end of the gas spray device to improve the uniformity of the reaction gas. However, in the case of a relatively large difference in the gas ratio, there is still a relatively large difference between the middle and the edge film thickness after coating. Therefore, it is necessary to further improve the uniformity of film formation

Method used

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Embodiment Construction

[0028] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the scope of protection of this application.

[0029] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the a...

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Abstract

The invention provides a gas spray device. The gas spray device comprises a ventilation system and a spray system which are arranged in an up-down corresponding mode; the spray system and the ventilation system are connected through a cylinder body of the gas spray device; the ventilation system comprises a side ventilation channel, a rotating mechanism and a gas wind shield; and the spray systemcomprises a spray head. According to the gas spray device provided by the invention, the gas flow speed of gas is increased according to the shape or the rotation speed of fan blades, and the mixing uniformity of the gas is enhanced.

Description

technical field [0001] The invention relates to the technical field of chemical vapor deposition, in particular to a gas shower device and a chemical vapor deposition method. Background technique [0002] Chemical vapor deposition method is a chemical technology, which mainly uses one or several gas-phase compounds or simple substances containing thin film elements to perform chemical reactions on the surface of the substrate to form thin films. Chemical vapor deposition is a new technique for preparing inorganic materials developed in recent decades. Chemical vapor deposition has been widely used to purify substances, develop new crystals, and deposit various single crystal, polycrystalline or glassy inorganic thin film materials. [0003] When chemical vapor deposition is used to produce inorganic thin film materials, during the deposition process of thin films, parameters such as gas flow, power, pressure, substrate temperature and distance between electrode plates are i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/455
CPCC23C16/45565C23C16/455
Inventor 王质武
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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