Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Organic silicon heat-conducting pouring silica gel with excellent performance

A technology of heat conduction potting and silicone, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of high product viscosity, poor oil leakage performance, difficult adhesion, etc., to achieve anti-corrosion Good precipitation, improve adhesion, reduce product viscosity

Active Publication Date: 2020-03-27
YANTAI DARBOND TECH
View PDF7 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The higher the thermal conductivity of low-cost thermal silica gel, the higher the filler ratio, which leads to the high viscosity of the product. In order to achieve low viscosity, a large amount of diluent silicone oil is added, which makes the oil leakage performance of the product very poor; The adhesiveness of the circuit board is also required to be higher and higher. Due to the presence of a lot of flux on the circuit board, it further leads to difficult adhesion.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Organic silicon heat-conducting pouring silica gel with excellent performance
  • Organic silicon heat-conducting pouring silica gel with excellent performance
  • Organic silicon heat-conducting pouring silica gel with excellent performance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] A component: successively weigh 7.0 g of methyl vinyl polysiloxane-1 (wherein m=48, vinyl content is 1.0 wt%) with a viscosity of 100 mPa.s such as structural formula (1); the viscosity is 50 mPa.s 8.5g of methyl vinyl polysiloxane-2 (where n=45, vinyl content is 0.80wt%) such as structural formula (2); 85g of thermal conductive powder; 1.5g of adhesive such as structural formula (4) (wherein K 1 =7,K 2 =4); Color paste 0.35g; Catalyst 0.04g of 5000ppm; Join in double planetary mixing tank, mix under vacuum state, promptly obtain A component;

[0050] Component B: Weigh 38g of methylvinyl polysiloxane-1 (wherein m=48, vinyl content is 1.0wt%) with a viscosity of 100mPa.s such as structural formula (1); the viscosity is 50mPa.s such as 3.0g of methyl vinyl polysiloxane-2 (wherein n=45, vinyl content is 0.80wt%) of structural formula (2); 84g of heat conducting powder; viscosity is 45mPa.s as the crosslinking agent of structural formula (3) (where a=12, b=14, hydrogen ...

Embodiment 2

[0052] Component A: Weigh 6.5g of methylvinyl polysiloxane-1 (wherein m=48, vinyl content is 1.0wt%) with a viscosity of 100mPa.s such as structural formula (1); the viscosity is 50mPa.s Such as structural formula (2) methyl vinyl polysiloxane-2 (wherein n=45, vinyl content is 0.80wt%) 9g; Thermal conductive powder 84g; Such as structural formula (4) adhesive 1.0g (wherein K 1 = 6,K 2 =5); Color paste 0.30g; Catalyst 0.05g of 5000ppm; Join in double planetary mixing kettle, mix under vacuum state, promptly obtain A component;

[0053] B component: successively weigh 36g of methylvinyl polysiloxane-1 (wherein m=48, vinyl content is 1.0wt%) whose viscosity is 100mPa.s such as structural formula (1); viscosity is 50mPa.s such as 3.5g of methyl vinyl polysiloxane-2 (wherein n=45, vinyl content is 0.80wt%) of structural formula (2); 85g of heat conducting powder; viscosity is 45mPa.s as the crosslinking agent of structural formula (3) (where a=12, b=14, hydrogen content is 0.35wt...

Embodiment 3

[0055]A component: successively weigh 7.5g of methylvinyl polysiloxane-1 (wherein m=45, vinyl content is 1.05wt%) with a viscosity of 95mPa.s such as structural formula (1); the viscosity is 55mPa.s Such as structural formula (2) methyl vinyl polysiloxane-2 (wherein n=50, vinyl content is 0.70wt%) 8g; Heat conduction powder 86g; Such as structural formula (4) adhesive 2.0g (wherein K 1 =8,K 2 =3); Color paste 0.0.4g; Catalyst 0.03g of 5000ppm; Join in double planetary mixing kettle, mix under vacuum state, promptly obtain A component;

[0056] Component B: Weigh 40 g of methylvinylpolysiloxane-1 (wherein m=50, vinyl content is 0.95wt%) whose viscosity is 105mPa.s such as structural formula (1); viscosity is 45mPa.s such as 3.0g of methyl vinyl polysiloxane-2 (wherein n=40, vinyl content is 0.85wt%) of structural formula (2); 83g of heat conducting powder; viscosity is 45mPa.s as the crosslinking agent of structural formula (3) (where a=10, b=16, hydrogen content is 0.40wt%) ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to organic silicon heat-conducting pouring silica gel with excellent performance. The component A and the component B comprises the following components according to the parts bymass: the component A: -16.5-7.5 parts of methyl vinyl polysiloxane, -28-9 parts of methyl vinyl polysiloxane, 84-86 parts of heat conduction powder, 1-2 parts of adhesive, 0.3-0.4 part of color paste and 0.03-0.05 part of catalyst; the component B: -136-40 parts of methyl vinyl polysiloxane, -22.5-3.5 parts of methyl vinyl polysiloxane, 83-85 parts of heat conduction powder, 2.7-3.0 parts of cross-linking agent and 0.008 to 0.012 part of inhibitor. The prepared heat conduction potting silica gel has the advantages of high heat conduction, low viscosity, low oil permeability, excellent settlement resistance and good adhesion to a PCB.

Description

technical field [0001] The present invention relates to a silicone high thermal conductivity silica gel with excellent performance, in particular to a silicone thermal conductivity potting with high proportion of thermal conductivity filler, low viscosity, low oil leakage, excellent anti-settling property and good adhesion to PCB circuit boards The adhesive belongs to the field of potting adhesives. [0002] technical background [0003] At present, the application trend of solvent-free thermal silica gel products in the market is getting better and better, and the annual usage of the products has been greatly increased. The competition in domestic and foreign markets is very fierce, and the cost pressure is very huge. The higher the thermal conductivity of low-cost thermal silica gel, the higher the filler ratio, which leads to the high viscosity of the product. In order to achieve low viscosity, a large amount of diluent silicone oil is added, which makes the oil leakage pe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09J183/07C09J11/04
CPCC08K2201/003C08L2201/08C08L2203/206C08L2205/025C08L2205/035C09J11/04C09J183/04C08L83/04C08K9/06C08K7/18
Inventor 孙刚王建斌陈田安
Owner YANTAI DARBOND TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com