A kind of tin-based alloy spherical solder powder automatic packaging equipment and packaging method

Abstract

An automatic packaging equipment and a packaging method for tin-based alloy spherical solder powder, the equipment comprises a feeding mechanism, an auxiliary agent automatic feeding device, a nitrogen-protected packaging chamber (27), an automatic measuring and weighing mechanism, an automatic bag feeding mechanism, and an upper bagging mechanism. A sealing mechanism (17), a nitrogen protection transition chamber (18), a bag-out belt scale (21) and a nitrogen filling mechanism. The device and method of the present invention are especially suitable for high-density, low-hardness metal powder packaging. The entire packaging process is completed in a nitrogen-filled and low-oxygen environment, especially for metal powders that need to be protected from oxidation. The packaged products have good appearance quality, high weight accuracy, low oxidation degree, high packaging qualification rate, and adopt a fully sealed packaging process, which improves the packaging environment and reduces the occupational hazards of employees contacting powder.

Description

technical field [0001] The invention relates to the technical field of metal powder packaging equipment and a packaging method, in particular to packaging equipment and a packaging method for tin-based alloy spherical solder powder. Background technique [0002] Solder material is an indispensable connection material in the electronics industry. The application of surface mount technology (STM) with solder paste as the main connection material makes the electronic assembly process more efficient and miniaturized. SMT technology has become the mainstream of electronic assembly technology. Solder paste is mainly composed of solder powder and solder paste, of which solder powder accounts for about 88-90% by weight, and is one of the most important materials for preparing solder paste. Tin-based spherical solder powder is currently widely used solder powder. Due to the particularity of spherical solder powder products, its packaging process is more complicated. First, mechanical...

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Problems solved by technology

At present, the packaging method is still generally manual packaging, and manual packaging has the following defects: First, the packaging efficiency is low and the labor cost is high, and one person mechanically re-screens (using a 100-200-mesh screen to remove tin flakes or foreign matter in the solder powder product) ), one person scoops powder measurement, one person adds auxiliary agents, and one person heat-sealing re-inspection, the whole packaging process requires 3 to 4 people; second, the working environment is poor, which is not conducive to occupational health. The product specifications of spherical solder powder are generally 400 mesh to 800 mesh , the particle size is small, dust will escape during the process of mechanical re-screening and scooping powder measurement, making it difficult to manage on-site management and occupational health; third, it is difficult to operate in a low-oxygen environment for manual packaging, so it will affect product quality. Certain hidden dangers

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