Photomask defect cleaning device and method

Abstract

The invention provides a photomask defect cleaning device and a photomask defect cleaning method. A cleaning device is used for cleaning a to-be-cleaned defect on a to-be-treated photomask, and the to-be-cleaned defect is formed on a to-be-treated surface of the to-be-treated photomask. A defect adsorption assembly is also included. A gap is formed between the defect adsorption assembly and the to-be-treated surface, and the defect adsorption assembly adsorbs the to-be-cleaned defect based on electrostatic induction to clean the to-be-treated photomask. According to the invention, a defect ofa semiconductor photomask is removed by using a non-destructive electrostatic adsorption principle and equipment in the process of removing the defect of the semiconductor photomask, and therefore, the purpose of cleaning the photomask is achieved. By the adoption of the scheme, the photomask defect can be removed, a protective film of the photomask can be prevented from being wrinkled or damagedin the removing process, meanwhile, the protective film can be prevented from being scratched, the comprehensive cleaning of the photomask defect can be further achieved, the device is simple and convenient, the cleaning process is simple and fast, and the cleaning speed is high.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a cleaning device and cleaning method for photomask defects. Background technique [0002] In the digital age, many electrical appliances and objects are controlled by high-tech IC chips to achieve the purpose of automation. IC chips are mainly composed of extremely precise semiconductor integrated circuits. The manufacturing process mainly uses photomasks in dust-free In the environment, high-precision wafers are used to perform high-precision lamination operations on wafers, and the manufacturing costs of the workshops and machines are relatively expensive. Therefore, in the process of manufacturing wafers, efforts are made to improve the mask The yield rate has become a more important topic for those skilled in the art. [0003] In semiconductor production and manufacturing, due to machine factors or human factors, it is inevitable that the photomask will ...

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a cleaning device and cleaning method for photomask defects, which are used to solve the difficulties in removing the defects on the photomask in the prior art and the existing methods of removing photomask defects. This method is easy to cause damage to the photomask protective film, slow cleaning speed, etc.

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