A method for stripping polyimide film based on multilayer graphene as sacrificial layer

Abstract

The invention belongs to the field of new application technologies, and more specifically relates to a polyimide film stripping method based on multilayer graphene as a sacrificial layer. A kind of polyimide film stripping method based on multilayer graphene as sacrificial layer provided by the invention, it obtains substrate / multilayer graphene film by arranging multilayer graphene film between substrate and polyimide film / Polyimide film stack, with graphene film as the sacrificial layer, by virtue of the weak van der Waals force between the multilayer graphene film layers and the van der Waals force between the graphene film layers and layers, the external force destroys the van der Waals force between the graphene film layers, and the The polyimide film is peeled off from the substrate. The multilayer graphene layers are connected by van der Waals force, which can slide like graphite. Using this property, the adhesion between the polyimide film and the glass substrate after high temperature can be effectively weakened. The peeling method provided by the invention is simple, the peeling effect is stable, and the properties of the polyimide film are not affected.

Description

technical field [0001] The invention belongs to the field of new application technologies, and more specifically relates to a polyimide film stripping method based on multilayer graphene as a sacrificial layer. Background technique [0002] In recent years, with the acceleration of the upgrading of the display industry, the demand for large-size flexible organic light-emitting diodes (OLEDs) will grow explosively, which will also drive the development and demand of flexible substrates. More flexible substrates currently used mainly include polymer plastics such as polyethylene terephthalate (PET), polycarbonate (PC), and polyethylene naphthalate (PEN). The above plastics have high transmittance (>85%), but all have a fatal disadvantage: poor heat resistance (Tg<120°C), and poor solvent resistance. It is well known that low-temperature polysilicon technology (LTPS), a necessary processing step in the preparation of large-scale flexible OLEDs, requires high processing t...

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Problems solved by technology

[0007] For the above defects or improvement needs of the prior art, the invention provides a polyimide film peeling method based on multilayer graphene as a sacrificial layer, which is achieved by arranging multilayer graphite between the substrate and the polyimide film. Graphene film, using graphene as a sacrificial layer, weakens the adhesion force between the polyimide film and the substrate by virtue of the weak van der Waals force between the multi-layer graphene layers, and the polyimide film is separated from the substrate The peeling method solves the technical problems of complex peeling methods for polyimide films, low peeling efficiency or damage to polyimide films in the prior art

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