Copper-clad aluminum bonding contact pin and bonding device thereof

Abstract

The invention relates to the technical field of lead bonding devices, and discloses a copper-clad aluminum bonding contact pin which comprises a contact pin. Bosses are symmetrically distributed on the right end of the contact pin. The thickness of the bosses is smaller than the thickness of the contact pin. According to the copper-clad aluminum bonding contact pin and the bonding device thereof,the bosses connected with the contact pin are used; the bosses penetrate a placement groove, so that the contact pin can be stably connected with the interior of a substrate; the contact pin does nottilt or loosen in the use process; a tightening latch is used; a second clamping groove formed in the tightening latch is connected with a clamping block in the substrate; the substrate and a sealingplate are self-locked through upward elastic force generated by a spring on the tightening latch without loosening; a copper block is stably connected with the contact pin through the cooperative useof the copper block and a cylinder; the stability of an oxide generated by the copper block in a bonding process is better than the stability of the oxide of aluminum, so that a bonding point is morestable; and the purpose of stable bonding is realized.

Description

technical field [0001] The invention relates to the technical field of wire bonding devices, in particular to a copper-clad aluminum bonding pin and a bonding device thereof. Background technique [0002] Wire bonding is the most common chip bonding technology, which can meet the needs of consumer large-scale electronic products, civilian products and military products. More than 96% of IC packages in the world use wire bonding. Before wire bonding, it is necessary to The back of the semiconductor chip is connected to the chip carrier with an adhesive material, and then with the help of a special bonding device, the electrode leads on the integrated circuit (IC) chip are connected with the outer leads of the IC base with metal wires. Therefore, The quality of the lead connection directly affects the yield of device manufacturing and the stability of the device. Often a qualified chip is scrapped due to broken wires, dotted lines, and short circuits. [0003] The existing al...

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Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a copper-clad aluminum bonding pin and its bonding device, which has the advantages of stable bonding and solves the problem of pin warping in the existing aluminum wire bonding process. In severe cases, the aluminum wire will fall off and the product will fail, and the external vibration will affect the bonding device during use, causing the connection part to loosen. On the other hand, the aluminum wire bonding process will cause Metal oxides, the structure is unstable, and it is easy to cause the aluminum wire bonding point to fall off

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